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Takeshi Yamaguchi
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Hadano, JP
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last 30 patents
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Patent Grant
Sealing structure for multi-chip module
Patent number
7,518,233
Issue date
Apr 14, 2009
Hitachi, Ltd.
Kouichi Takahashi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Surface mounting structure
Patent number
5,926,375
Issue date
Jul 20, 1999
Hitachi, Ltd.
Hideki Watanabe
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR