Takeshi Yuzawa

Person

Chino, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including a buffer layer structure for reducin...
- Patent number 10,658,325
- Issue date May 19, 2020
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a buffer layer structure for reducin...
- Patent number 10,103,120
- Issue date Oct 16, 2018
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chip, wiring, conducti...
- Patent number 9,842,821
- Issue date Dec 12, 2017
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a buffer layer structure for reducin...
- Patent number 9,515,043
- Issue date Dec 6, 2016
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a buffer layer structure for reducin...
- Patent number 9,331,039
- Issue date May 3, 2016
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a buffer layer structure for reducin...
- Patent number 9,093,334
- Issue date Jul 28, 2015
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a buffer layer structure for reducin...
- Patent number 8,952,554
- Issue date Feb 10, 2015
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a conductive layer reliably formed unde...
- Patent number 8,878,365
- Issue date Nov 4, 2014
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a buffer layer structure for reducin...
- Patent number 8,742,601
- Issue date Jun 3, 2014
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a buffer layer structure for reducin...
- Patent number 8,614,513
- Issue date Dec 24, 2013
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,441,125
- Issue date May 14, 2013
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,936,064
- Issue date May 3, 2011
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,598,612
- Issue date Oct 6, 2009
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device that improves electrical connection reliability
- Patent number 7,560,814
- Issue date Jul 14, 2009
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device that improves electrical connection reliability
- Patent number 7,230,338
- Issue date Jun 12, 2007
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive bumps, method of manufacturi...
- Patent number 7,176,581
- Issue date Feb 13, 2007
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing the same, circuit boa...
- Patent number 7,037,758
- Issue date May 2, 2006
- Seiko Epson Corporation
- Fumiaki Karasawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCIN...
- Publication number 20190019773
- Publication date Jan 17, 2019
- SEIKO EPSON CORPORATION
- Takeshi YUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCIN...
- Publication number 20180076138
- Publication date Mar 15, 2018
- SEIKO EPSON CORPORATION
- Takeshi YUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCIN...
- Publication number 20170077058
- Publication date Mar 16, 2017
- SEIKO EPSON CORPORATION
- Takeshi YUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCIN...
- Publication number 20160225732
- Publication date Aug 4, 2016
- SEIKO EPSON CORPORATION
- Takeshi YUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCIN...
- Publication number 20150287690
- Publication date Oct 8, 2015
- SEIKO EPSON CORPORATION
- Takeshi YUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCIN...
- Publication number 20150102489
- Publication date Apr 16, 2015
- SEIKO EPSON CORPORATION
- Takeshi YUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140361433
- Publication date Dec 11, 2014
- Takeshi YUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCIN...
- Publication number 20140217583
- Publication date Aug 7, 2014
- SEIKO EPSON CORPORATION
- Takeshi YUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCIN...
- Publication number 20140048933
- Publication date Feb 20, 2014
- SEIKO EPSON CORPORATION
- Takeshi YUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120032324
- Publication date Feb 9, 2012
- SEIKO EPSON CORPORATION
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110169161
- Publication date Jul 14, 2011
- SEIKO EPSON CORPORATION
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20090035929
- Publication date Feb 5, 2009
- SEIKO EPSON CORPORATION
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20070257363
- Publication date Nov 8, 2007
- SEIKO EPSON CORPORATION
- Takeshi YUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device that improves electrical connection reliability
- Publication number 20070228560
- Publication date Oct 4, 2007
- SEIKO EPSON CORPORATION
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20070035022
- Publication date Feb 15, 2007
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20070018317
- Publication date Jan 25, 2007
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20070013065
- Publication date Jan 18, 2007
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20060125095
- Publication date Jun 15, 2006
- SEIKO EPSON CORPORATION
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, circuit board, and electronic instrument
- Publication number 20050269697
- Publication date Dec 8, 2005
- SEIKO EPSON CORPORATION
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20050272243
- Publication date Dec 8, 2005
- SEIKO EPSON CORPORATION
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method of manufacturing thereof, circuit boar...
- Publication number 20050253260
- Publication date Nov 17, 2005
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method of manufacturing the same, circuit boa...
- Publication number 20040180549
- Publication date Sep 16, 2004
- SEIKO EPSON CORPORATION
- Fumiaki Karasawa
- H01 - BASIC ELECTRIC ELEMENTS

Takeshi Yuzawa

Person

Patents Grantslast 30 patents

Semiconductor device including a buffer layer structure for reducin...

Semiconductor device including a buffer layer structure for reducin...

Semiconductor device including semiconductor chip, wiring, conducti...

Semiconductor device including a buffer layer structure for reducin...

Semiconductor device including a buffer layer structure for reducin...

Semiconductor device including a buffer layer structure for reducin...

Semiconductor device including a buffer layer structure for reducin...

Semiconductor device having a conductive layer reliably formed unde...

Semiconductor device including a buffer layer structure for reducin...

Semiconductor device including a buffer layer structure for reducin...

Semiconductor device

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device that improves electrical connection reliability

Semiconductor device that improves electrical connection reliability

Semiconductor device having conductive bumps, method of manufacturi...

Semiconductor device, method of manufacturing the same, circuit boa...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCIN...

SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCIN...

SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCIN...

SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCIN...

SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCIN...

SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCIN...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCIN...

SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCIN...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Method of manufacturing semiconductor device

SEMICONDUCTOR DEVICE

Semiconductor device that improves electrical connection reliability

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device, circuit board, and electronic instrument

Method of manufacturing semiconductor device

Semiconductor device, method of manufacturing thereof, circuit boar...

Semiconductor device, method of manufacturing the same, circuit boa...