Taketoshi Shikano

Person

Fukuoka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor device and manufacturing method thereof
- Patent number 11,735,509
- Issue date Aug 22, 2023
- Mitsubishi Electric Corporation
- Keitaro Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,387,173
- Issue date Jul 12, 2022
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor apparatus and manufacturing method therefor
- Patent number 11,107,746
- Issue date Aug 31, 2021
- Mitsubishi Electric Corporation
- Hiroshi Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method for manufacturing semiconductor device
- Patent number 10,541,193
- Issue date Jan 21, 2020
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,104,775
- Issue date Oct 16, 2018
- Mitsubishi Electric Corporation
- Naoki Yoshimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method for manufacturing the same
- Patent number 9,947,613
- Issue date Apr 17, 2018
- Mitsubishi Electric Corporation
- Hiroshi Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method of manufacturing the same
- Patent number 9,716,072
- Issue date Jul 25, 2017
- Mitsubishi Electric Corporation
- Hiroshi Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,691,730
- Issue date Jun 27, 2017
- Mitsubishi Electric Corporation
- Naoki Yoshimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 9,627,302
- Issue date Apr 18, 2017
- Mitsubishi Electric Corporation
- Keitaro Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,466,548
- Issue date Oct 11, 2016
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,437,460
- Issue date Sep 6, 2016
- Mitsubishi Electric Corporation
- Naoki Yoshimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,171,772
- Issue date Oct 27, 2015
- Mitsubishi Electric Corporation
- Taketoshi Shikano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device including removing a...
- Patent number 8,518,751
- Issue date Aug 27, 2013
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,334,176
- Issue date Dec 18, 2012
- Mitsubishi Electric Corporation
- Ken Sakamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing a semiconductor device having a semiconduct...
- Patent number 8,183,094
- Issue date May 22, 2012
- Mitsubishi Electric Corporation
- Taketoshi Shikano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a semiconductor chip and resin sealing...
- Patent number 7,855,464
- Issue date Dec 21, 2010
- Mitsubishi Electric Corporation
- Taketoshi Shikano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold resin-sealed power semiconductor device having insulating resi...
- Patent number 7,151,311
- Issue date Dec 19, 2006
- Mitsubishi Denki Kabushiki Kaisha
- Dai Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-molded device and manufacturing apparatus thereof
- Patent number 6,791,167
- Issue date Sep 14, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Kenichi Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-sealed semiconductor device
- Patent number 6,753,596
- Issue date Jun 22, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Dai Nakajima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240047318
- Publication date Feb 8, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE GROUP, AND POWER CONVERS...
- Publication number 20230411253
- Publication date Dec 21, 2023
- Mitsubishi Electric Corporation
- Taketoshi SHIKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230335480
- Publication date Oct 19, 2023
- Mitsubishi Electric Corporation
- Keitaro ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230187308
- Publication date Jun 15, 2023
- Mitsubishi Electric Corporation
- Masanori TSUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200303295
- Publication date Sep 24, 2020
- Mitsubishi Electric Corporation
- Keitaro ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200091047
- Publication date Mar 19, 2020
- Mitsubishi Electric Corporation
- Ken SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREFOR
- Publication number 20190057928
- Publication date Feb 21, 2019
- Mitsubishi Electric Corporation
- Hiroshi KAWASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170294369
- Publication date Oct 12, 2017
- Mitsubishi Electric Corporation
- Hiroshi KAWASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170148709
- Publication date May 25, 2017
- Mitsubishi Electric Corporation
- Ken SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160343644
- Publication date Nov 24, 2016
- Mitsubishi Electric Corporation
- Hiroshi KAWASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20160233151
- Publication date Aug 11, 2016
- Mitsubishi Electric Corporation
- Keitaro ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160099224
- Publication date Apr 7, 2016
- Mitsubishi Electric Corporation
- Naoki YOSHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150380274
- Publication date Dec 31, 2015
- Mitsubishi Electric Corporation
- Naoki YOSHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150092379
- Publication date Apr 2, 2015
- Mitsubishi Electric Corporation
- Naoki YOSHIMATSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140353814
- Publication date Dec 4, 2014
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140054751
- Publication date Feb 27, 2014
- Mitsubishi Electric Corporation
- TAKETOSHI SHIKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120196405
- Publication date Aug 2, 2012
- MITSUBISHI ELECTRIC CORPORATION
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120088337
- Publication date Apr 12, 2012
- MITSUBISHI ELECTRIC CORPORATION
- Ken SAKAMOTO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A SEMICONDUCT...
- Publication number 20110033986
- Publication date Feb 10, 2011
- MITSUBISHI ELECTRIC CORPORATION
- TAKETOSHI SHIKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100007026
- Publication date Jan 14, 2010
- MITSUBISHI ELECTRIC CORPORATION
- Taketoshi SHIKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-SEALED SEMICONDUCTOR DEVICE
- Publication number 20040108602
- Publication date Jun 10, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Dai Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mold resin-sealed power semiconductor device having insulating resi...
- Publication number 20040089928
- Publication date May 13, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Dai Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-molded device and manufacturing apparatus thereof
- Publication number 20030183907
- Publication date Oct 2, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Kenichi Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Base interconnection substrate, manufacturing method thereof, semic...
- Publication number 20020149121
- Publication date Oct 17, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Taketoshi Shikano
- H01 - BASIC ELECTRIC ELEMENTS

Taketoshi Shikano

Person

Patents Grantslast 30 patents

Power semiconductor device and manufacturing method thereof

Method for manufacturing semiconductor device

Power semiconductor apparatus and manufacturing method therefor

Lead frame and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

Power semiconductor device and method for manufacturing the same

Power semiconductor device and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Power semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Method for manufacturing semiconductor device

Semiconductor device

Method for manufacturing semiconductor device including removing a...

Method of manufacturing semiconductor device

Method of manufacturing a semiconductor device having a semiconduct...

Semiconductor device having a semiconductor chip and resin sealing...

Mold resin-sealed power semiconductor device having insulating resi...

Resin-molded device and manufacturing apparatus thereof

Resin-sealed semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE GROUP, AND POWER CONVERS...

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREFOR

POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

LEAD FRAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

POWER SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A SEMICONDUCT...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

RESIN-SEALED SEMICONDUCTOR DEVICE

Mold resin-sealed power semiconductor device having insulating resi...

Resin-molded device and manufacturing apparatus thereof

Base interconnection substrate, manufacturing method thereof, semic...