Takeyuki Nakagawa

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Tray conveying apparatus and method
- Patent number 6,283,695
- Issue date Sep 4, 2001
- Kabushiki Kaisha Shinkawa
- Takeyuki Nakagawa
- G01 - MEASURING TESTING
Information Patent Grant
Wire bend inspection method and apparatus
- Patent number 5,818,958
- Issue date Oct 6, 1998
- Kabushiki Kaisha Shinkawa
- Hiromi Tomiyama
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Workpiece conveying apparatus used with workpiece inspection device
- Patent number 5,772,040
- Issue date Jun 30, 1998
- Kabushiki Kaisha Shinkawa
- Hiromi Tomiyama
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Grant
Bonding wire height detection method
- Patent number 5,583,641
- Issue date Dec 10, 1996
- Kabushiki Kaisha Shinkawa
- Hiromi Tomiyama
- G01 - MEASURING TESTING
Information Patent Grant
Frame retainer mount used in bonding machines
- Patent number 5,154,339
- Issue date Oct 13, 1992
- Kabushiki Kaisha Shinkawa
- Takashi Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamping device for bonding machines
- Patent number 5,116,031
- Issue date May 26, 1992
- Kabushiki Kaisha Shinkawa
- Takashi Takeuchi
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS