Taku Iwamoto

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Laser processing apparatus
- Patent number 10,207,362
- Issue date Feb 19, 2019
- Disco Corporation
- Wataru Odagiri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 9,870,961
- Issue date Jan 16, 2018
- Disco Corporation
- Taku Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 9,779,994
- Issue date Oct 3, 2017
- Disco Corporation
- Hironari Ohkubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective film forming method for forming a protective film on a w...
- Patent number 9,761,442
- Issue date Sep 12, 2017
- Disco Corporation
- Taku Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20170186656
- Publication date Jun 29, 2017
- Disco Corporation
- Taku Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20170186646
- Publication date Jun 29, 2017
- Disco Corporation
- Hironari Ohkubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE FILM FORMING METHOD
- Publication number 20170140928
- Publication date May 18, 2017
- Disco Corporation
- Taku Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING APPARATUS
- Publication number 20170014947
- Publication date Jan 19, 2017
- Disco Corporation
- Wataru Odagiri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR