Taku Maruo

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Polishing device and method of polishing semiconductor wafer
- Patent number 9,550,273
- Issue date Jan 24, 2017
- Kabushiki Kaisha Toshiba
- Shiguma Kato
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
POLISHING DEVICE AND METHOD OF POLISHING SEMICONDUCTOR WAFER
- Publication number 20160207165
- Publication date Jul 21, 2016
- KABUSHIKI KAISHA TOSHIBA
- Shiguma KATO
- H01 - BASIC ELECTRIC ELEMENTS