Taku Yoshida

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Ibaraki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer, and method for polishing semiconductor wafer
- Patent number 10,679,842
- Issue date Jun 9, 2020
- JX Nippon Mining & Metals Corporation
- Taku Yoshida
- B24 - GRINDING POLISHING
Information Patent Grant
Flexible laminate and flexible electronic circuit board formed by u...
- Patent number 8,487,191
- Issue date Jul 16, 2013
- JX Nippon Mining & Metals Corporation
- Nobuhito Makino
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER, AND METHOD FOR POLISHING SEMICONDUCTOR WAFER
- Publication number 20190189421
- Publication date Jun 20, 2019
- JX NIPPON MINING & METALS CORPORATION
- Taku YOSHIDA
- B24 - GRINDING POLISHING
Information Patent Application
Metal-Coated Polyimide Resin Substrate with Excellent Thermal Aging...
- Publication number 20120034475
- Publication date Feb 9, 2012
- JX NIPPON MINING & METALS CORPORATION
- Taku Yoshida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Flexible Laminate and Flexible Electronic Circuit Board Formed by u...
- Publication number 20120012367
- Publication date Jan 19, 2012
- JX NIPPON MINING & METALS CORPORATION
- Nobuhito Makino
- B32 - LAYERED PRODUCTS
Information Patent Application
Metal-Coated Polyimide Resin Substrate with Excellent Thermal Aging...
- Publication number 20110318602
- Publication date Dec 29, 2011
- JX NIPPON MINING & METALS CORPORATION
- Taku Yoshida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR