Takuji Ide

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Higashimurayama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having stacked semiconductor chips sealed with...
- Patent number 7,199,469
- Issue date Apr 3, 2007
- Renesas Technology Corp.
- Toru Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 6,879,037
- Issue date Apr 12, 2005
- Renesas Technology Corp.
- Takashi Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 6,727,114
- Issue date Apr 27, 2004
- Hitachi, Ltd.
- Takashi Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 6,420,783
- Issue date Jul 16, 2002
- Hitachi, Ltd.
- Takashi Wada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20040056363
- Publication date Mar 25, 2004
- Hitachi, Ltd.
- Takashi Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020043717
- Publication date Apr 18, 2002
- Toru Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20020027266
- Publication date Mar 7, 2002
- Takashi Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20010028107
- Publication date Oct 11, 2001
- Takashi Wada
- H01 - BASIC ELECTRIC ELEMENTS