Takuji Okeyui

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, substrate for producing semiconductor device...
- Patent number 8,525,351
- Issue date Sep 3, 2013
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, substrate for producing semiconductor device...
- Patent number 8,018,044
- Issue date Sep 13, 2011
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, substrate for producing semiconductor device...
- Patent number 7,943,427
- Issue date May 17, 2011
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuel cell
- Patent number 7,862,954
- Issue date Jan 4, 2011
- Aquafairy Corporation
- Masaya Yano
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor device fabricating apparatus and semiconductor device...
- Patent number 7,365,441
- Issue date Apr 29, 2008
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition for semiconductor encapsulation, semiconduc...
- Patent number 7,262,514
- Issue date Aug 28, 2007
- Nitto Denko Corporation
- Keisuke Yoshikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for manufacturing semiconductor device, adhesive sheet for u...
- Patent number 7,235,888
- Issue date Jun 26, 2007
- Nitto Denko Corporation
- Kazuhito Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for manufacturing semiconductor device
- Patent number 7,132,755
- Issue date Nov 7, 2006
- Nitto Denko Corporation
- Kazuhito Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabricating apparatus and semiconductor device...
- Patent number 7,064,011
- Issue date Jun 20, 2006
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device, adhesive sheet for u...
- Patent number 6,858,473
- Issue date Feb 22, 2005
- Nitto Denko Corporation
- Kazuhito Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the removal of resist material
- Patent number 6,565,704
- Issue date May 20, 2003
- Nitto Denko Corporation
- Eiji Toyoda
- B08 - CLEANING
Information Patent Grant
Double-sided circuit board and multilayer wiring board comprising t...
- Patent number 6,373,000
- Issue date Apr 16, 2002
- Nitto Denko Corporation
- Kei Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer wiring board and method for manufacturing the same
- Patent number 6,335,076
- Issue date Jan 1, 2002
- Nitto Denko Corporation
- Kei Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-scale package structure and circuit board attached thereto
- Patent number 6,333,469
- Issue date Dec 25, 2001
- Nitto Denko Corporation
- Yasushi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the removal of resist material
- Patent number 6,245,188
- Issue date Jun 12, 2001
- Nitto Denko Corporation
- Eiji Toyoda
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
PROTECTING FILM FOR BLADE OF WIND POWER GENERATOR
- Publication number 20130243605
- Publication date Sep 19, 2013
- Nitto Denko Corporation
- Hiroyuki WATANABE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Device, Substrate for Producing Semiconductor Device...
- Publication number 20110291303
- Publication date Dec 1, 2011
- Nitto Denko Corporation
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTING FILM FOR BLADE OF WIND POWER GENERATOR
- Publication number 20110058950
- Publication date Mar 10, 2011
- Nitto Denko Corporation
- Hiroyuki WATANABE
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Reinforcing sheet for wind power generator blades, reinforcing stru...
- Publication number 20110031758
- Publication date Feb 10, 2011
- Nitto Denko Corporation
- Yoshiaki Mitsuoka
- F05 - INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF...
Information Patent Application
Foam filling material for wind power generator blades, foam filling...
- Publication number 20110031759
- Publication date Feb 10, 2011
- Nitto Denko Corporation
- Yoshiaki Mitsuoka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Vibration damping sheet for wind power generator blades, vibration...
- Publication number 20110031757
- Publication date Feb 10, 2011
- Nitto Denko Corporation
- Yoshiaki Mitsuoka
- F05 - INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF...
Information Patent Application
FUEL CELL
- Publication number 20090017354
- Publication date Jan 15, 2009
- Masaya Yano
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Fuel Cell and Power Generating Method
- Publication number 20080248338
- Publication date Oct 9, 2008
- Masaya Yano
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Device, Substrate for Producing Semiconductor Device...
- Publication number 20080048311
- Publication date Feb 28, 2008
- DAI NIPPON PRINTING CO., LTD.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Substrate for Producing Semiconductor Device...
- Publication number 20070241445
- Publication date Oct 18, 2007
- DAI NIPPON PRINTING CO., LTD.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device fabricating apparatus and semiconductor device...
- Publication number 20060145363
- Publication date Jul 6, 2006
- DAI NIPPON PRINTING CO., LTD.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Epoxy resin composition for semiconductor encapsulation, semiconduc...
- Publication number 20050253286
- Publication date Nov 17, 2005
- NITTO DENKO CORPORATION
- Keisuke Yoshikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive film for manufacturing semiconductor device
- Publication number 20050133936
- Publication date Jun 23, 2005
- NITTO DENKO CORPORATION
- Kazuhito Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing Semiconductor device, adhesive sheet for u...
- Publication number 20050133824
- Publication date Jun 23, 2005
- Kazuhito Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin metal layers-having ceramic green sheet and method for produci...
- Publication number 20050030696
- Publication date Feb 10, 2005
- NITTO DENKO CORPORATION
- Kazuo Ouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device fabricating apparatus and semiconductor device...
- Publication number 20040164387
- Publication date Aug 26, 2004
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor device, adhesive sheet for u...
- Publication number 20040018659
- Publication date Jan 29, 2004
- Kazuhito Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal transfer sheet, producing method thereof, and producing metho...
- Publication number 20030219608
- Publication date Nov 27, 2003
- Hitoshi Ishizaka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process for the removal of resist material
- Publication number 20010015259
- Publication date Aug 23, 2001
- Eiji Toyoda
- B08 - CLEANING
Information Patent Application
Double-sided circuit board and multilayer wiring board comprising t...
- Publication number 20010004944
- Publication date Jun 28, 2001
- Kei Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Takuji Okeyui

Person

Patents Grantslast 30 patents

Semiconductor device, substrate for producing semiconductor device...

Semiconductor device, substrate for producing semiconductor device...

Semiconductor device, substrate for producing semiconductor device...

Fuel cell

Semiconductor device fabricating apparatus and semiconductor device...

Epoxy resin composition for semiconductor encapsulation, semiconduc...

Method for manufacturing semiconductor device, adhesive sheet for u...

Adhesive film for manufacturing semiconductor device

Semiconductor device fabricating apparatus and semiconductor device...

Method for manufacturing semiconductor device, adhesive sheet for u...

Process for the removal of resist material

Double-sided circuit board and multilayer wiring board comprising t...

Multi-layer wiring board and method for manufacturing the same

Wafer-scale package structure and circuit board attached thereto

Process for the removal of resist material

Patents Applicationslast 30 patents

PROTECTING FILM FOR BLADE OF WIND POWER GENERATOR

Semiconductor Device, Substrate for Producing Semiconductor Device...

PROTECTING FILM FOR BLADE OF WIND POWER GENERATOR

Reinforcing sheet for wind power generator blades, reinforcing stru...

Foam filling material for wind power generator blades, foam filling...

Vibration damping sheet for wind power generator blades, vibration...

FUEL CELL

Fuel Cell and Power Generating Method

Semiconductor Device, Substrate for Producing Semiconductor Device...

Semiconductor Device, Substrate for Producing Semiconductor Device...

Semiconductor device fabricating apparatus and semiconductor device...

Epoxy resin composition for semiconductor encapsulation, semiconduc...

Adhesive film for manufacturing semiconductor device

Method for manufacturing Semiconductor device, adhesive sheet for u...

Thin metal layers-having ceramic green sheet and method for produci...

Semiconductor device fabricating apparatus and semiconductor device...

Method for manufacturing semiconductor device, adhesive sheet for u...

Metal transfer sheet, producing method thereof, and producing metho...

Process for the removal of resist material

Double-sided circuit board and multilayer wiring board comprising t...