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Takuma MAEKAWA
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Osaka, JP
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Patents Grants
last 30 patents
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Patent Grant
Conductive bump and electroless Pt plating bath
Patent number
11,049,838
Issue date
Jun 29, 2021
C. Uyemura & Co., Ltd.
Takuma Maekawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electroless plating bath
Patent number
10,947,623
Issue date
Mar 16, 2021
C. Uyemura & Co., Ltd.
Takuma Maekawa
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
ETCHANT AND METHOD OF SURFACE TREATMENT OF ALUMINUM OR ALUMINUM ALLOY
Publication number
20230407487
Publication date
Dec 21, 2023
C. Uyemura & Co., Ltd.
Takuma Maekawa
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
METAL DISPLACEMENT SOLUTION, METHOD FOR SURFACE TREATMENT OF ALUMIN...
Publication number
20230151493
Publication date
May 18, 2023
C. Uyemura & Co., Ltd.
Takuma Maekawa
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
ELECTROLESS GOLD PLATING BATH
Publication number
20230111446
Publication date
Apr 13, 2023
C. Uyemura & Co., Ltd.
Sayuri TANAKA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
ELECTROLESS PALLADIUM PLATING BATH
Publication number
20220033973
Publication date
Feb 3, 2022
C. Uyemura & Co., Ltd.
Takuma MAEKAWA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
ELECTROLESS PLATING BATH
Publication number
20200173030
Publication date
Jun 4, 2020
C. Uyemura & Co., Ltd.
Takuma MAEKAWA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
CONDUCTIVE BUMP AND ELECTROLESS Pt PLATING BATH
Publication number
20200020660
Publication date
Jan 16, 2020
C. Uyemura & Co., Ltd.
Takuma MAEKAWA
H01 - BASIC ELECTRIC ELEMENTS