Takuma Tsubota

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Aluminum/ceramic bonding substrate and method for producing same
- Patent number 12,221,389
- Issue date Feb 11, 2025
- Dowa Metaltech Co., Ltd.
- Koji Kobayashi
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
ALUMINUM/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20220033317
- Publication date Feb 3, 2022
- DOWA METALTECH CO, LTD.
- Koji Kobayashi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...