Takumi Kooriike

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device and method of fabricating the same
- Patent number 8,093,101
- Issue date Jan 10, 2012
- Taiyo Yuden Co., Ltd.
- Kaoru Sakinada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a surface acoustic wave device
- Patent number 7,854,050
- Issue date Dec 21, 2010
- Taiyo Yuden Co., Ltd.
- Shunichi Aikawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of manufacturing an acoustic wave device
- Patent number 7,841,064
- Issue date Nov 30, 2010
- Taiyo Yuden Co., Ltd.
- Shunichi Aikawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic device and method of fabricating the same
- Patent number 7,816,794
- Issue date Oct 19, 2010
- Fujitsu Media Devices Limited
- Kaoru Sakinada
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Package for electronic device, base substrate, electronic device an...
- Patent number 7,304,417
- Issue date Dec 4, 2007
- Fujitsu Media Devices Limited
- Shingo Masuko
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Surface acoustic wave device and manufacturing method of the same
- Patent number 7,301,224
- Issue date Nov 27, 2007
- Fujitsu Media Devices Limited
- Naoyuki Mishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic surface wave device
- Patent number 6,037,698
- Issue date Mar 14, 2000
- Fujitsu Limited
- Masanori Ueda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Piezoelectric element package in which a piezoelectric element on a...
- Patent number 5,838,093
- Issue date Nov 17, 1998
- Fujitsu Limited
- Yoshimi Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SURFACE ACOUSTIC WAVE DEVICE, AND MANUFACTURING METHOD THEREFOR
- Publication number 20090096321
- Publication date Apr 16, 2009
- FUJITSU MEDIA DEVICES LIMITED
- Shunichi Aikawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Acoustic wave device and method of manufacturing the same
- Publication number 20080125662
- Publication date May 29, 2008
- FUJITSU MEDIA DEVICES LIMITED
- Shunichi Aikawa
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Electronic device and method of fabricating the same
- Publication number 20080111247
- Publication date May 15, 2008
- FUJITSU MEDIA DEVICES LIMITED
- Kaoru Sakinada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and method of fabricating the same
- Publication number 20060138672
- Publication date Jun 29, 2006
- FUJITSU MEDIA DEVICES LIMITED
- Kaoru Sakinada
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Surface acoustic wave device and manufacturing method of the same
- Publication number 20060049489
- Publication date Mar 9, 2006
- FUJITSU MEDIA DEVICES LIMITED
- Naoyuki Mishima
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Package for electronic device, base substrate, electronic device an...
- Publication number 20040226741
- Publication date Nov 18, 2004
- Shingo Masuko
- H03 - BASIC ELECTRONIC CIRCUITRY

Takumi Kooriike

Person

Patents Grantslast 30 patents

Electronic device and method of fabricating the same

Method of manufacturing a surface acoustic wave device

Method of manufacturing an acoustic wave device

Electronic device and method of fabricating the same

Package for electronic device, base substrate, electronic device an...

Surface acoustic wave device and manufacturing method of the same

Acoustic surface wave device

Piezoelectric element package in which a piezoelectric element on a...

Patents Applicationslast 30 patents

SURFACE ACOUSTIC WAVE DEVICE, AND MANUFACTURING METHOD THEREFOR

Acoustic wave device and method of manufacturing the same

Electronic device and method of fabricating the same

Electronic device and method of fabricating the same

Surface acoustic wave device and manufacturing method of the same

Package for electronic device, base substrate, electronic device an...