Takumi Masuyama

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Optical module
- Patent number 10,586,770
- Issue date Mar 10, 2020
- Fujitsu Limited
- Takayoshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 10,444,450
- Issue date Oct 15, 2019
- Fujitsu Limited
- Takayoshi Matsumura
- G02 - OPTICS
Information Patent Grant
Semiconductor mounting apparatus, head thereof, and method for manu...
- Patent number 9,905,528
- Issue date Feb 27, 2018
- Fujitsu Limited
- Hidehiko Kira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device mounting method
- Patent number 9,793,221
- Issue date Oct 17, 2017
- Fujitsu Limited
- Hidehiko Kira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating header of semiconductor mounting apparatus and bonding meth...
- Patent number 9,536,857
- Issue date Jan 3, 2017
- Fujitsu Limited
- Hidehiko Kira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of determining reinforcement position of circuit substrate a...
- Patent number 9,053,262
- Issue date Jun 9, 2015
- Fujitsu Limited
- Hiroshi Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL MODULE
- Publication number 20190157207
- Publication date May 23, 2019
- Fujitsu Limited
- Takayoshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE
- Publication number 20180341075
- Publication date Nov 29, 2018
- Fujitsu Limited
- Takayoshi Matsumura
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL MODULE
- Publication number 20180217343
- Publication date Aug 2, 2018
- Fujitsu Limited
- Takayoshi Matsumura
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR MOUNTING APPARATUS, HEAD THEREOF, AND METHOD FOR MANU...
- Publication number 20170186721
- Publication date Jun 29, 2017
- Fujitsu Limited
- Hidehiko Kira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTING METHOD
- Publication number 20160284566
- Publication date Sep 29, 2016
- Fujitsu Limited
- Hidehiko Kira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD DEVICE AND ELECTRONIC DEVICE
- Publication number 20140078700
- Publication date Mar 20, 2014
- Fujitsu Limited
- Takumi MASUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT TRANSFER CAP AND REPAIRING APPARATUS AND METHOD
- Publication number 20130322057
- Publication date Dec 5, 2013
- Fujitsu Limited
- Toru OKADA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20130256022
- Publication date Oct 3, 2013
- Fujitsu Limited
- Hiroshi KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DETERMINING REINFORCEMENT POSITION OF CIRCUIT SUBSTRATE A...
- Publication number 20130128477
- Publication date May 23, 2013
- Hiroshi KOBAYASHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOLDER JOINT STRUCTURE, ELECTRONIC DEVICE USING THE SAME, AND SOLDE...
- Publication number 20100326726
- Publication date Dec 30, 2010
- FUJITSU LIMITED
- Hisao Tanaka
- G11 - INFORMATION STORAGE

Takumi Masuyama

Person

Patents Grantslast 30 patents

Optical module

Optical module

Semiconductor mounting apparatus, head thereof, and method for manu...

Semiconductor device mounting method

Heating header of semiconductor mounting apparatus and bonding meth...

Method of determining reinforcement position of circuit substrate a...

Patents Applicationslast 30 patents

OPTICAL MODULE

OPTICAL MODULE

OPTICAL MODULE

SEMICONDUCTOR MOUNTING APPARATUS, HEAD THEREOF, AND METHOD FOR MANU...

SEMICONDUCTOR DEVICE MOUNTING METHOD

CIRCUIT BOARD DEVICE AND ELECTRONIC DEVICE

HEAT TRANSFER CAP AND REPAIRING APPARATUS AND METHOD

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

METHOD OF DETERMINING REINFORCEMENT POSITION OF CIRCUIT SUBSTRATE A...

SOLDER JOINT STRUCTURE, ELECTRONIC DEVICE USING THE SAME, AND SOLDE...