Takumi Odaira

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Kitamoto, JP

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Patents Grantslast 30 patents

Information Patent Grant
Pure copper material, insulating substrate, and electronic device
- Patent number 12,286,698
- Issue date Apr 29, 2025
- Mitsubishi Materials Corporation
- Takumi Odaira
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Pure copper material, insulating substrate, and electronic device
- Patent number 12,264,390
- Issue date Apr 1, 2025
- Mitsubishi Materials Corporation
- Yuki Ito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
PURE COPPER MATERIAL, INSULATING SUBSTRATE, AND ELECTRONIC DEVICE
- Publication number 20250109462
- Publication date Apr 3, 2025
- MITSUBISHI MATERIALS CORPORATION
- Takumi ODAIRA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PURE COPPER MATERIAL, INSULATING SUBSTRATE, AND ELECTRONIC DEVICE
- Publication number 20250109463
- Publication date Apr 3, 2025
- MITSUBISHI MATERIALS CORPORATION
- Yuki ITO
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...