TREA

Takumi OHKABE

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  • Saitama, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Ag alloy bonding wire for semiconductor device
    • Patent number 11,612,966
    • Issue date Mar 28, 2023
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya Oyamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor devices
    • Patent number 11,342,299
    • Issue date May 24, 2022
    • Nippon Micrometal Corporation
    • Daizo Oda
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

  • Information Patent Application

    Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20220266396
    • Publication date Aug 25, 2022
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya OYAMADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20220108971
    • Publication date Apr 7, 2022
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20180374816
    • Publication date Dec 27, 2018
    • Nippon Micrometal Corporation
    • Daizo ODA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...