Takumi Ueno

Person

Hachiohji, JP

People

Patents Grantslast 30 patents

Information Patent Grant
High dielectric constant composite material and multilayer wiring b...
- Patent number 7,220,481
- Issue date May 22, 2007
- Hitachi, Ltd.
- Yuichi Satsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, semiconductor wafer, semiconductor module, an...
- Patent number 7,217,992
- Issue date May 15, 2007
- Renesas Technology Corp.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring tape for semiconductor device including a buffer layer havin...
- Patent number 7,038,325
- Issue date May 2, 2006
- Hitachi Cable, Ltd.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and mounting method for same
- Patent number 6,940,162
- Issue date Sep 6, 2005
- Renesas Technology Corp.
- Shuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High dielectric constant composite material and multilayer wiring b...
- Patent number 6,924,971
- Issue date Aug 2, 2005
- Hitachi, Ltd.
- Yuichi Satsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, semiconductor wafer, semiconductor module, an...
- Patent number 6,888,230
- Issue date May 3, 2005
- Renesas Technology Corp.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and mounting method for same
- Patent number 6,784,541
- Issue date Aug 31, 2004
- Hitachi, Ltd.
- Shuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 6,710,263
- Issue date Mar 23, 2004
- Renesas Technology Corporation
- Toshiyuki Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device comprising stress relaxation layers and method...
- Patent number 6,710,446
- Issue date Mar 23, 2004
- Renesas Technology Corporation
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal stable low elastic modulus material and device using the same
- Patent number 6,638,631
- Issue date Oct 28, 2003
- Hitachi, Ltd.
- Yuichi Satsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermal stable low elastic modulus material and device using the same
- Patent number 6,638,352
- Issue date Oct 28, 2003
- Hitachi, Ltd.
- Yuichi Satsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor module and method of mounting
- Patent number 6,627,997
- Issue date Sep 30, 2003
- Hitachi, Ltd.
- Shuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite material member for semiconductor device and insulated an...
- Patent number 6,579,623
- Issue date Jun 17, 2003
- Hitachi, Ltd.
- Yasutoshi Kurihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a porous buffer layer for semiconductor...
- Patent number 6,433,440
- Issue date Aug 13, 2002
- Hitachi, Ltd.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same technica...
- Patent number 6,396,145
- Issue date May 28, 2002
- Hitachi, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and a manufacturing method thereof
- Patent number 6,348,741
- Issue date Feb 19, 2002
- Hitachi, Ltd.
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, method for forming pattern theref...
- Patent number 6,291,619
- Issue date Sep 18, 2001
- Hitachi Chemical Co., Ltd.
- Yasunari Maekawa
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Resin sealed semiconductor devices and a process for manufacturing...
- Patent number 6,097,100
- Issue date Aug 1, 2000
- Hitachi, Ltd.
- Shuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positive photosensitive resin composition and electronic apparatus...
- Patent number 5,858,584
- Issue date Jan 12, 1999
- Hitachi, Ltd.
- Yoshiaki Okabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Pattern forming material and process for forming pattern using the...
- Patent number 5,470,996
- Issue date Nov 28, 1995
- Hitachi, Ltd.
- Takumi Ueno
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of forming pattern and making semiconductor device using rad...
- Patent number 5,441,849
- Issue date Aug 15, 1995
- Hitachi, Ltd.
- Hiroshi Shiraishi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of forming a pattern
- Patent number 5,328,807
- Issue date Jul 12, 1994
- Hitichi, Ltd.
- Toshihiko Tanaka
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Pattern forming material and process for forming pattern using the...
- Patent number 5,118,582
- Issue date Jun 2, 1992
- Hitachi, Ltd.
- Takumi Ueno
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Resist pattern forming process with dry etching
- Patent number 4,835,089
- Issue date May 30, 1989
- Hitachi, Ltd.
- Takao Iwayanagi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Radiation-sensitive resist composition with an admixture of cis-(1,...
- Patent number 4,722,881
- Issue date Feb 2, 1988
- Hitachi, Ltd.
- Takumi Ueno
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Pattern-formation method with iodine containing azide and oxygen pl...
- Patent number 4,465,768
- Issue date Aug 14, 1984
- Hitachi, Ltd.
- Takumi Ueno
- C07 - ORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor module and mounting method for same
- Publication number 20040251540
- Publication date Dec 16, 2004
- Shuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, semiconductor wafer, semiconductor module, an...
- Publication number 20040217453
- Publication date Nov 4, 2004
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring tape for semiconductor device including a buffer layer havin...
- Publication number 20040195702
- Publication date Oct 7, 2004
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite material member for semiconductor device and insulated an...
- Publication number 20030201530
- Publication date Oct 30, 2003
- Hitachi, Ltd.
- Yasutoshi Kurihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor module and mounting method for same
- Publication number 20030071348
- Publication date Apr 17, 2003
- Shuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal stable low elastic modulus material and device using the same
- Publication number 20030047351
- Publication date Mar 13, 2003
- Yuichi Satsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal stable low elastic modulus material and device using the same
- Publication number 20030049193
- Publication date Mar 13, 2003
- Yuichi Satsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High dielectric constant composite material and multilayer wiring b...
- Publication number 20030030999
- Publication date Feb 13, 2003
- Hitachi, Ltd
- Yuichi Satsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite material member for semiconductor device and insulated an...
- Publication number 20020192488
- Publication date Dec 19, 2002
- Yasutoshi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High dielectric constant composite material and multilayer wiring b...
- Publication number 20020168510
- Publication date Nov 14, 2002
- Yuichi Satsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and wiring tape for semiconductor device
- Publication number 20020158343
- Publication date Oct 31, 2002
- Masahiko Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacture thereof
- Publication number 20020130412
- Publication date Sep 19, 2002
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices
- Publication number 20010023983
- Publication date Sep 27, 2001
- Toshiyuki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Takumi Ueno

Person

Patents Grantslast 30 patents

High dielectric constant composite material and multilayer wiring b...

Semiconductor device, semiconductor wafer, semiconductor module, an...

Wiring tape for semiconductor device including a buffer layer havin...

Semiconductor module and mounting method for same

High dielectric constant composite material and multilayer wiring b...

Semiconductor device, semiconductor wafer, semiconductor module, an...

Semiconductor module and mounting method for same

Semiconductor devices

Semiconductor device comprising stress relaxation layers and method...

Thermal stable low elastic modulus material and device using the same

Thermal stable low elastic modulus material and device using the same

Semiconductor module and method of mounting

Composite material member for semiconductor device and insulated an...

Semiconductor device having a porous buffer layer for semiconductor...

Semiconductor device and method for manufacturing the same technica...

Semiconductor apparatus and a manufacturing method thereof

Photosensitive resin composition, method for forming pattern theref...

Resin sealed semiconductor devices and a process for manufacturing...

Positive photosensitive resin composition and electronic apparatus...

Pattern forming material and process for forming pattern using the...

Method of forming pattern and making semiconductor device using rad...

Method of forming a pattern

Pattern forming material and process for forming pattern using the...

Resist pattern forming process with dry etching

Radiation-sensitive resist composition with an admixture of cis-(1,...

Pattern-formation method with iodine containing azide and oxygen pl...

Patents Applicationslast 30 patents

Semiconductor module and mounting method for same

Semiconductor device, semiconductor wafer, semiconductor module, an...

Wiring tape for semiconductor device including a buffer layer havin...

Composite material member for semiconductor device and insulated an...

Semiconductor module and mounting method for same

Thermal stable low elastic modulus material and device using the same

Thermal stable low elastic modulus material and device using the same

High dielectric constant composite material and multilayer wiring b...

Composite material member for semiconductor device and insulated an...

High dielectric constant composite material and multilayer wiring b...

Semiconductor device and wiring tape for semiconductor device

Semiconductor device and method of manufacture thereof

Semiconductor devices