Takumi Yanagawa

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for etching an etch layer
- Patent number 12,020,944
- Issue date Jun 25, 2024
- Lam Research Corporation
- Nikhil Dole
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Three or more states for achieving high aspect ratio dielectric etch
- Patent number 10,861,708
- Issue date Dec 8, 2020
- Lam Research Corporation
- Takumi Yanagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of achieving high selectivity for high aspect ratio dielectr...
- Patent number 10,847,377
- Issue date Nov 24, 2020
- Lam Research Corporation
- Nikhil Dole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of sidewall notching for high aspect ratio 3D NAND etch
- Patent number 10,741,407
- Issue date Aug 11, 2020
- Lam Research Corporation
- Nikhil Dole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of achieving high selectivity for high aspect ratio dielectr...
- Patent number 10,515,821
- Issue date Dec 24, 2019
- Lam Research Corporation
- Nikhil Dole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three or more states for achieving high aspect ratio dielectric etch
- Patent number 10,504,744
- Issue date Dec 10, 2019
- Lam Research Corporation
- Takumi Yanagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing twisting in ultra-high aspect ratio dielectric etch
- Patent number 8,741,165
- Issue date Jun 3, 2014
- Lam Research Corporation
- Bing Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for plasma etching performance enhancement
- Patent number 7,977,390
- Issue date Jul 12, 2011
- Lam Research Corporation
- Bing Ji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR ETCHING AN ETCH LAYER
- Publication number 20240297050
- Publication date Sep 5, 2024
- LAM RESEARCH CORPORATION
- Nikhil Dole
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR ETCHING A HIGH ASPECT RATIO STRUCTURE
- Publication number 20240120209
- Publication date Apr 11, 2024
- LAM RESEARCH CORPORATION
- Nikhil Dole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMISTRY FOR HIGH ASPECT RATIO ETCH FOR 3D-NAND
- Publication number 20230260798
- Publication date Aug 17, 2023
- LAM RESEARCH CORPORATION
- Nikhil Dole
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TUNABILITY OF EDGE PLASMA DENSITY FOR TILT CONTROL
- Publication number 20230063007
- Publication date Mar 2, 2023
- LAM RESEARCH CORPORATION
- John Holland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ETCHING AN ETCH LAYER
- Publication number 20210335624
- Publication date Oct 28, 2021
- LAM RESEARCH CORPORATION
- Nikhil DOLE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REDUCTION OF SIDEWALL NOTCHING FOR HIGH ASPECT RATIO 3D NAND ETCH
- Publication number 20200126804
- Publication date Apr 23, 2020
- LAM RESEARCH CORPORATION
- Nikhil Dole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ACHIEVING HIGH SELECTIVITY FOR HIGH ASPECT RATIO DIELECTR...
- Publication number 20200090945
- Publication date Mar 19, 2020
- LAM RESEARCH CORPORATION
- Nikhil Dole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE OR MORE STATES FOR ACHIEVING HIGH ASPECT RATIO DIELECTRIC ETCH
- Publication number 20200090948
- Publication date Mar 19, 2020
- LAM RESEARCH CORPORATION
- Takumi Yanagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ACHIEVING HIGH SELECTIVITY FOR HIGH ASPECT RATIO DIELECTR...
- Publication number 20190393047
- Publication date Dec 26, 2019
- LAM RESEARCH CORPORATION
- Nikhil Dole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma Module With Slotted Ground Plate
- Publication number 20170076917
- Publication date Mar 16, 2017
- Applied Materials, Inc.
- Joseph Yudovsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REDUCING TWISTING IN ULTRA-HIGH ASPECT RATIO DIELECTRIC ETCH
- Publication number 20110021030
- Publication date Jan 27, 2011
- LAM RESEARCH CORPORATION
- Bing Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING TWISTING IN ULTRA-HIGH ASPECT RATIO DIELECTRIC ETCH
- Publication number 20080119055
- Publication date May 22, 2008
- Lam Research Corporation
- Bing Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for plasma etching performance enhancement
- Publication number 20070026677
- Publication date Feb 1, 2007
- Lam Research Corporation
- Bing Ji
- H01 - BASIC ELECTRIC ELEMENTS

Takumi Yanagawa

Person

Patents Grantslast 30 patents

Method for etching an etch layer

Three or more states for achieving high aspect ratio dielectric etch

Method of achieving high selectivity for high aspect ratio dielectr...

Reduction of sidewall notching for high aspect ratio 3D NAND etch

Method of achieving high selectivity for high aspect ratio dielectr...

Three or more states for achieving high aspect ratio dielectric etch

Reducing twisting in ultra-high aspect ratio dielectric etch

Method for plasma etching performance enhancement

Patents Applicationslast 30 patents

METHOD FOR ETCHING AN ETCH LAYER

SYSTEMS AND METHODS FOR ETCHING A HIGH ASPECT RATIO STRUCTURE

CHEMISTRY FOR HIGH ASPECT RATIO ETCH FOR 3D-NAND

TUNABILITY OF EDGE PLASMA DENSITY FOR TILT CONTROL

METHOD FOR ETCHING AN ETCH LAYER

REDUCTION OF SIDEWALL NOTCHING FOR HIGH ASPECT RATIO 3D NAND ETCH

METHOD OF ACHIEVING HIGH SELECTIVITY FOR HIGH ASPECT RATIO DIELECTR...

THREE OR MORE STATES FOR ACHIEVING HIGH ASPECT RATIO DIELECTRIC ETCH

METHOD OF ACHIEVING HIGH SELECTIVITY FOR HIGH ASPECT RATIO DIELECTR...

Plasma Module With Slotted Ground Plate

REDUCING TWISTING IN ULTRA-HIGH ASPECT RATIO DIELECTRIC ETCH

REDUCING TWISTING IN ULTRA-HIGH ASPECT RATIO DIELECTRIC ETCH

Method for plasma etching performance enhancement