Takuro USHIDA

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Toyama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus and method of manufacturing semicond...
- Patent number 11,967,501
- Issue date Apr 23, 2024
- Kokusai Electric Corporation
- Hiroaki Hiramatsu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and method of manufacturing semicond...
- Patent number 11,261,528
- Issue date Mar 1, 2022
- Kokusai Electric Corporation
- Hiroaki Hiramatsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Substrate Processing Apparatus and Method of Manufacturing Semicond...
- Publication number 20220145464
- Publication date May 12, 2022
- Kokusai Electric Corporation
- Hiroaki HIRAMATSU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Substrate Processing Apparatus and Method of Manufacturing Semicond...
- Publication number 20200407851
- Publication date Dec 31, 2020
- Kokusai Electric Corporation
- Hiroaki HIRAMATSU
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS