Takuro USHIDA

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Toyama-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 9,953,830
- Issue date Apr 24, 2018
- Hitachi Kokusai Electric Inc.
- Takuro Ushida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 9,916,976
- Issue date Mar 13, 2018
- Hitachi Kokusai Electric Inc.
- Takuro Ushida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20170018419
- Publication date Jan 19, 2017
- Hitachi Kokusai Electric Inc.
- Takuro USHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20170004961
- Publication date Jan 5, 2017
- Hitachi Kokusai Electric Inc.
- Takuro USHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...