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Takuto HIDANI

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  • Osaka-shi, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Substrate for a printed wiring board
    • Patent number 12,058,812
    • Issue date Aug 6, 2024
    • Sumitomo Electric Industries, Ltd.
    • Takuto Hidani
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240407085
    • Publication date Dec 5, 2024
    • Sumitomo Electric Industries, Ltd.
    • Yosuke FUKAYA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BASE MATERIAL FOR PRINTED CIRCUIT, PRINTED CIRCUIT, AND METHOD OF M...
    • Publication number 20230371176
    • Publication date Nov 16, 2023
    • Sumitomo Electric Industries, Ltd.
    • Takuto HIDANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE FOR A PRINTED WIRING BOARD
    • Publication number 20230039742
    • Publication date Feb 9, 2023
    • Sumitomo Electric Industries, Ltd.
    • Takuto HIDANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR