Takuya Hasegawa

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Ayase-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Component-embedded substrate manufacturing method
- Patent number 9,526,182
- Issue date Dec 20, 2016
- MEIKO ELECTRONICS CO., LTD.
- Ryoichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component-embedded substrate, and method of manufacturing the compo...
- Patent number 8,921,706
- Issue date Dec 30, 2014
- Meiko Electronics Co., Ltd.
- Mitsuaki Toda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE MANUFACTURING METHOD AND COMPONENT-EMB...
- Publication number 20140347835
- Publication date Nov 27, 2014
- Meiko Electronics Co., Ltd.
- Ryoichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE, AND METHOD OF MANUFACTURING THE COMPO...
- Publication number 20130176701
- Publication date Jul 11, 2013
- Meiko Electronics Co., Ltd.
- Mitsuaki Toda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR