Takuya Sasaki

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Nishishirakawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for raising polishing pad and polishing method
- Patent number 10,307,885
- Issue date Jun 4, 2019
- Shin-Etsu Handotai Co., Ltd.
- Takuya Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reclaiming processing method for delaminated wafer
- Patent number 9,496,130
- Issue date Nov 15, 2016
- Shin-Etsu Handotai Co., Ltd.
- Toru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing silicon wafer
- Patent number 9,425,056
- Issue date Aug 23, 2016
- Shin-Etsu Handotai Co., Ltd.
- Takuya Sasaki
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR RAISING POLISHING PAD AND POLISHING METHOD
- Publication number 20170341204
- Publication date Nov 30, 2017
- Shin-Etsu Handotai Co., Ltd.
- Takuya SASAKI
- G01 - MEASURING TESTING
Information Patent Application
RECLAIMING PROCESSING METHOD FOR DELAMINATED WAFER
- Publication number 20140273400
- Publication date Sep 18, 2014
- Shin-Etsu Handotai Co., Ltd.
- Toru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SILICON WAFER
- Publication number 20130316521
- Publication date Nov 28, 2013
- Shin-Etsu Handotai Co., Ltd.
- Takuya Sasaki
- H01 - BASIC ELECTRIC ELEMENTS