Takuya Satoh

Person

Kanagawa-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solder bump height stabilization for micro and fine pitch electrode...
- Patent number 11,062,731
- Issue date Jul 13, 2021
- Western Digital Technologies, Inc.
- Takuya Satoh
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatus for detaching a head slider joined to a mounting plate of...
- Patent number 8,099,862
- Issue date Jan 24, 2012
- Hitachi Global Storage Technologies Netherlands B.V.
- Yoshio Uematsu
- G11 - INFORMATION STORAGE
Information Patent Grant
Head gimbal assembly method with solder fillet formed by laser irra...
- Patent number 7,486,480
- Issue date Feb 3, 2009
- Hitachi Global Storage Technolgies Netherlands B.V.
- Takuya Satoh
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of removing lead-free solder from slider pad and magnetic di...
- Patent number 7,342,749
- Issue date Mar 11, 2008
- Hitachi Global Storage Technologies Netherlands B.V.
- Nobuyuki Hashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of constructing an integrated lead suspension
- Patent number 7,168,154
- Issue date Jan 30, 2007
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of constructing an integrated lead suspension
- Patent number 7,137,188
- Issue date Nov 21, 2006
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of constructing an integrated lead suspension
- Patent number 7,137,189
- Issue date Nov 21, 2006
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated lead suspension and method of construction
- Patent number 6,989,969
- Issue date Jan 24, 2006
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated lead suspension and method of construction
- Patent number 6,985,335
- Issue date Jan 10, 2006
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated lead suspension and method of construction
- Patent number 6,879,465
- Issue date Apr 12, 2005
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of constructing an integrated lead suspension
- Patent number 6,871,392
- Issue date Mar 29, 2005
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatus and method for separating head gimbal assembly from bondi...
- Patent number 6,848,167
- Issue date Feb 1, 2005
- International Business Machines Corporation
- Yasuhiro Mita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball disposing apparatus, solder ball reflow apparatus, and...
- Patent number 6,742,694
- Issue date Jun 1, 2004
- Hitachi Global Storage Technologies Netherlands B.V.
- Takuya Satoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder-ball bonding device and method
- Patent number 6,543,677
- Issue date Apr 8, 2003
- International Business Machines Corporation
- Surya Pattanaik
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding performing method and method for transforming, r...
- Patent number 6,382,499
- Issue date May 7, 2002
- International Business Machines Corporation
- Takuya Satoh
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for ultrasonic bonding of slider and lead in a hard disk dri...
- Patent number 6,321,974
- Issue date Nov 27, 2001
- International Business Machines Corporation
- Tatsumi Tsuchiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Head support arm having conductive wires of a disk drive device
- Patent number 6,052,259
- Issue date Apr 18, 2000
- International Business Machines Corporation
- Yasuhiro Mita
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SOLDER-JET NOZZLE, LASER-SOLDERING TOOL, AND METHOD, FOR LASERSOLDE...
- Publication number 20130256281
- Publication date Oct 3, 2013
- Tatsumi Tsuchiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing head gimbal assembly and apparatus for det...
- Publication number 20090077792
- Publication date Mar 26, 2009
- Hitachi Global Storage Technologies Netherlands B.V.
- Yoshio Uematsu
- G11 - INFORMATION STORAGE
Information Patent Application
Manufacturing method of head gimbal assembly with solder fillet and...
- Publication number 20060193084
- Publication date Aug 31, 2006
- Hitachi Global Storage Technologies Netherlands B.V.
- Takuya Satoh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of removing lead-free solder from slider pad and magnetic di...
- Publication number 20060012918
- Publication date Jan 19, 2006
- Hitachi Global Storage Technologies Netherlands B.V.
- Nobuyuki Hashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated lead suspension and method of construction
- Publication number 20050078415
- Publication date Apr 14, 2005
- Tatsumi Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated lead suspension and method of construction
- Publication number 20050063096
- Publication date Mar 24, 2005
- Tatsumi Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated lead suspension and method of construction
- Publication number 20050047020
- Publication date Mar 3, 2005
- Tatsumi Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated lead suspension and method of construction
- Publication number 20050047022
- Publication date Mar 3, 2005
- Tatsumi Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated lead suspension and method of construction
- Publication number 20050047009
- Publication date Mar 3, 2005
- Tatsumi Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated lead suspension and method of construction
- Publication number 20030188887
- Publication date Oct 9, 2003
- Tatsumi Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated lead suspension and method of construction
- Publication number 20030070834
- Publication date Apr 17, 2003
- International Business Machines Corporation
- Tatsumi Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solder-ball bonding device and method
- Publication number 20020179696
- Publication date Dec 5, 2002
- International Business Machines Corporation
- Surya Pattanaik
- G11 - INFORMATION STORAGE
Information Patent Application
Solder ball disposing apparatus, solder ball reflow apparatus, and...
- Publication number 20020113115
- Publication date Aug 22, 2002
- International Business Machines Corporation
- Takuya Satoh
- G11 - INFORMATION STORAGE
Information Patent Application
Apparatus and method for separating head gimbal assembly from bondi...
- Publication number 20010054225
- Publication date Dec 27, 2001
- International Business Machines Corporation
- Yasuhiro Mita
- G11 - INFORMATION STORAGE

Takuya Satoh

Person

Patents Grantslast 30 patents

Solder bump height stabilization for micro and fine pitch electrode...

Apparatus for detaching a head slider joined to a mounting plate of...

Head gimbal assembly method with solder fillet formed by laser irra...

Method of removing lead-free solder from slider pad and magnetic di...

Method of constructing an integrated lead suspension

Method of constructing an integrated lead suspension

Method of constructing an integrated lead suspension

Integrated lead suspension and method of construction

Integrated lead suspension and method of construction

Integrated lead suspension and method of construction

Method of constructing an integrated lead suspension

Apparatus and method for separating head gimbal assembly from bondi...

Solder ball disposing apparatus, solder ball reflow apparatus, and...

Solder-ball bonding device and method

Ultrasonic bonding performing method and method for transforming, r...

Method for ultrasonic bonding of slider and lead in a hard disk dri...

Head support arm having conductive wires of a disk drive device

Patents Applicationslast 30 patents

SOLDER-JET NOZZLE, LASER-SOLDERING TOOL, AND METHOD, FOR LASERSOLDE...

Method for manufacturing head gimbal assembly and apparatus for det...

Manufacturing method of head gimbal assembly with solder fillet and...

Method of removing lead-free solder from slider pad and magnetic di...

Integrated lead suspension and method of construction

Integrated lead suspension and method of construction

Integrated lead suspension and method of construction

Integrated lead suspension and method of construction

Integrated lead suspension and method of construction

Integrated lead suspension and method of construction

Integrated lead suspension and method of construction

Solder-ball bonding device and method

Solder ball disposing apparatus, solder ball reflow apparatus, and...

Apparatus and method for separating head gimbal assembly from bondi...