TAKUYA YAMAMOTO

Person

Ageo City, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Copper clad laminate
- Patent number 7,851,053
- Issue date Dec 14, 2010
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper foil provided with dielectric layer for forming capacitor la...
- Patent number 7,524,552
- Issue date Apr 28, 2009
- Mitsui Mining & Smelting Co., Ltd.
- Toshiko Yokota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper clad laminate
- Patent number 7,358,189
- Issue date Apr 15, 2008
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for printed-wiring board and copper-clad laminate using...
- Patent number 6,989,199
- Issue date Jan 24, 2006
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil and metal foil with carrier foil for printed wiring boa...
- Patent number 6,902,824
- Issue date Jun 7, 2005
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 6,827,867
- Issue date Dec 7, 2004
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing process for printed wiring board
- Patent number 6,716,572
- Issue date Apr 6, 2004
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board comprising electrodep...
- Patent number 6,660,406
- Issue date Dec 9, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooper clad laminate with cooper-plated circuit layer, and method f...
- Patent number 6,652,993
- Issue date Nov 25, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite material used in making printed wiring boards
- Patent number 6,548,153
- Issue date Apr 15, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Takashi Kataoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrolytic copper foil with carrier foil and copper-clad laminate...
- Patent number 6,541,126
- Issue date Apr 1, 2003
- Mitsui Mining & Smelting Co., Ltd.
- Junshi Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Making and using an ultra-thin copper foil
- Patent number 6,319,620
- Issue date Nov 20, 2001
- Mitsui Mining & Smelting Co., Ltd.
- Takashi Kataoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Making and using an ultra-thin copper foil
- Patent number 6,270,889
- Issue date Aug 7, 2001
- Mitsui Mining & Smelting Co., Ltd.
- Takashi Kataoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITE SHEET
- Publication number 20090034156
- Publication date Feb 5, 2009
- TAKUYA YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CLAD LAMINATE
- Publication number 20080171220
- Publication date Jul 17, 2008
- Mitsui Mining and Smelting Co., Ltd.
- Takuya Yamamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
Copper foil provided with dielectric layer for forming capacitor la...
- Publication number 20060057420
- Publication date Mar 16, 2006
- Toshiko Yokota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming polymide coating containing dielectric filler on...
- Publication number 20050161149
- Publication date Jul 28, 2005
- Mitsui Mining & Smelting Co.,
- Toshiko Yokota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Printed wiring board-use copper foil and copper clad laminated shee...
- Publication number 20040053019
- Publication date Mar 18, 2004
- Takuya Yamamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Surface treated copper foil, electrodeposited copper foil with carr...
- Publication number 20030148136
- Publication date Aug 7, 2003
- Mitsui Mining & Smelting Co. Ltd.
- Takuya Yamamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper clad laminate with copper-plated circuit layer, and method f...
- Publication number 20020182434
- Publication date Dec 5, 2002
- MITSUI MINING AND SMELTING CO., LTD
- Takuya Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Composite material used in making printed wiring boards
- Publication number 20020090497
- Publication date Jul 11, 2002
- Takashi Kataoka
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Manufacturing process for printed wiring board
- Publication number 20020081530
- Publication date Jun 27, 2002
- MITSUI MINING AND SMELTING CO., LTD
- Takuya Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Copper foil and metal foil with carrier foil for printed wiring boa...
- Publication number 20020079133
- Publication date Jun 27, 2002
- Mitsui Mining & Smelting Co. Ltd.
- Takuya Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Making and using an ultra-thin copper foil
- Publication number 20020070120
- Publication date Jun 13, 2002
- Takashi Kataoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper clad laminate
- Publication number 20020041032
- Publication date Apr 11, 2002
- MITSUI MINING AND SMELTING CO., LTD
- Takuya Yamamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
Copper foil circuit with a carrier, method for manufacturing printe...
- Publication number 20020004124
- Publication date Jan 10, 2002
- Yutaka Hirasawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method for manufacturing printed wiring board comprising electrodep...
- Publication number 20020004123
- Publication date Jan 10, 2002
- Takuya Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method for manufacturing printed wiring board
- Publication number 20010042732
- Publication date Nov 22, 2001
- Takuya Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

TAKUYA YAMAMOTO

Person

Patents Grantslast 30 patents

Copper clad laminate

Copper foil provided with dielectric layer for forming capacitor la...

Copper clad laminate

Copper foil for printed-wiring board and copper-clad laminate using...

Copper foil and metal foil with carrier foil for printed wiring boa...

Method for manufacturing printed wiring board

Manufacturing process for printed wiring board

Method for manufacturing printed wiring board comprising electrodep...

Cooper clad laminate with cooper-plated circuit layer, and method f...

Composite material used in making printed wiring boards

Electrolytic copper foil with carrier foil and copper-clad laminate...

Making and using an ultra-thin copper foil

Making and using an ultra-thin copper foil

Patents Applicationslast 30 patents

COMPOSITE SHEET

COPPER CLAD LAMINATE

Copper foil provided with dielectric layer for forming capacitor la...

Method of forming polymide coating containing dielectric filler on...

Printed wiring board-use copper foil and copper clad laminated shee...

Surface treated copper foil, electrodeposited copper foil with carr...

Copper clad laminate with copper-plated circuit layer, and method f...

Composite material used in making printed wiring boards

Manufacturing process for printed wiring board

Copper foil and metal foil with carrier foil for printed wiring boa...

Making and using an ultra-thin copper foil

Copper clad laminate

Copper foil circuit with a carrier, method for manufacturing printe...

Method for manufacturing printed wiring board comprising electrodep...

Method for manufacturing printed wiring board