Talee Yu

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Device under bonding pad using single metallization
- Patent number 8,373,272
- Issue date Feb 12, 2013
- Semiconductor Manufacturing International (Shanghai) Corporation
- Chi Kang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low voltage trigger and save area electrostatic discharge device
- Patent number 7,265,422
- Issue date Sep 4, 2007
- Semiconductor Manufacturing International (Shanghai) Corporation
- Talee Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power-on solution to avoid crowbar current for multiple power suppl...
- Patent number 7,233,178
- Issue date Jun 19, 2007
- Semiconductor Manufacturing International (Shanghai) Corporation
- Talee Yu
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
DEVICE UNDER BONDING PAD USING SINGLE METALLIZATION
- Publication number 20110037177
- Publication date Feb 17, 2011
- Semiconductor Manufacturing International (Shanghai) Corporation
- CHI KANG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL CHARGE PUMP
- Publication number 20100164600
- Publication date Jul 1, 2010
- Semiconductor Manufacturing International (Shanghai) Corporation
- CHI KANG LIU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Low voltage trigger and save area electrostatic discharge device
- Publication number 20070048944
- Publication date Mar 1, 2007
- Semiconductor Manufacturing International (Shanghai) Corporation
- Talee Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power-on solution to avoid crowbar current for multiple power suppl...
- Publication number 20060220706
- Publication date Oct 5, 2006
- Semiconductor Manufacturing International (Shanghai) Corporation
- Talee Yu
- H03 - BASIC ELECTRONIC CIRCUITRY