Tan Eng Hwa

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Stress relieving film for semiconductor packages
- Patent number 7,187,075
- Issue date Mar 6, 2007
- National Semiconductor Corporation
- Tan Eng Hwa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SAWN POWER PACKAGE AND METHOD OF FABRICATING SAME
- Publication number 20080096319
- Publication date Apr 24, 2008
- National Semiconductor Corporation
- Tan Eng Hwa
- H01 - BASIC ELECTRIC ELEMENTS