Tan Hien Boon

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Structure and method for fabricating a bond pad structure
- Patent number 7,276,797
- Issue date Oct 2, 2007
- Chartered Semiconductor Manufacturing Ltd.
- Zhang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of phoslon (PNO) for borderless contact fabrication, etch stop/...
- Patent number 7,148,157
- Issue date Dec 12, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Hsia Liang Choo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure and method for fabricating a bond pad structure
- Patent number 6,998,335
- Issue date Feb 14, 2006
- Chartered Semiconductor Manufacturing, Ltd.
- Zhang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device with thermal enhancement and method of packaging
- Patent number 6,921,974
- Issue date Jul 26, 2005
- United Test & Assembly Center Ltd.
- Tan Hien Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-package conversion kit for a pick and place handler
- Patent number 6,718,608
- Issue date Apr 13, 2004
- ST Assembly Test Services PTE LTD
- Sum Kai Wah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die paddle enhancement for exposed pad in semiconductor packaging
- Patent number 6,380,048
- Issue date Apr 30, 2002
- ST Assembly Test Services PTE LTD
- Tan Hien Boon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUITS INCLUDING COPPER PILLAR STRUCTURES AND METHODS...
- Publication number 20150187714
- Publication date Jul 2, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Mahesh Anant Bhatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for fabricating a bond pad structure
- Publication number 20060071350
- Publication date Apr 6, 2006
- Zhang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of packaging circuit device and packaged device
- Publication number 20040195697
- Publication date Oct 7, 2004
- United Test & Assembly Center Ltd.
- Tan Hien Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged device and method of packaging
- Publication number 20040188864
- Publication date Sep 30, 2004
- United Test & Assembly Center Ltd.
- Tan Hien Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of phoslon (PNO) for borderless contact fabrication, etch stop/...
- Publication number 20040077181
- Publication date Apr 22, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Hsia Liang Choo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multi-package conversion kit for a pick and place handler
- Publication number 20030140475
- Publication date Jul 31, 2003
- ST ASSEMBLY TEST SERVICES PTE LTD
- Sum Kai Wah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Tan Hien Boon

Person

Patents Grantslast 30 patents

Structure and method for fabricating a bond pad structure

Use of phoslon (PNO) for borderless contact fabrication, etch stop/...

Structure and method for fabricating a bond pad structure

Packaged device with thermal enhancement and method of packaging

Multi-package conversion kit for a pick and place handler

Die paddle enhancement for exposed pad in semiconductor packaging

Patents Applicationslast 30 patents

INTEGRATED CIRCUITS INCLUDING COPPER PILLAR STRUCTURES AND METHODS...

Structure and method for fabricating a bond pad structure

Method of packaging circuit device and packaged device

Packaged device and method of packaging

Use of phoslon (PNO) for borderless contact fabrication, etch stop/...

Multi-package conversion kit for a pick and place handler