Tan Kian Shing Michael

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit devices with stacked package interposers
- Patent number 8,058,716
- Issue date Nov 15, 2011
- Micron Technology, Inc.
- Chew Beng Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices with stacked package interposers
- Patent number 7,622,798
- Issue date Nov 24, 2009
- Micron Technology, Inc.
- Chew Beng Chye
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Circuit Devices with Stacked Package Interposers
- Publication number 20100065955
- Publication date Mar 18, 2010
- Micron Technology, Inc.
- Chew Beng Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method And System For Removing Tape From Substrates
- Publication number 20080308221
- Publication date Dec 18, 2008
- Tan Kian Shing Michael
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Integrated circuit devices with stacked package interposers
- Publication number 20070246840
- Publication date Oct 25, 2007
- Micron Technology, Inc.
- Chew Beng Chye
- H01 - BASIC ELECTRIC ELEMENTS