TREA

Tan Siew Sang

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  • Kedah, MY
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Patents Grantslast 30 patents

  • Information Patent Grant

    Apparatus for solder crack deflection
    • Patent number 7,923,125
    • Issue date Apr 12, 2011
    • Intel Corporation
    • Chung C. Key
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method for solder crack deflection
    • Patent number 7,223,633
    • Issue date May 29, 2007
    • Intel Corporation
    • Chung C. Key
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Apparatus for solder crack deflection
    • Publication number 20070170592
    • Publication date Jul 26, 2007
    • Chung C. Key
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Method for solder crack deflection
    • Publication number 20040102029
    • Publication date May 27, 2004
    • Chung C. Key
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...