Tang-Yuan CHEN

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 12,166,009
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,742,324
- Issue date Aug 29, 2023
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,594,660
- Issue date Feb 28, 2023
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure
- Patent number 11,227,823
- Issue date Jan 18, 2022
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having continously formed tapered prot...
- Patent number 11,164,756
- Issue date Nov 2, 2021
- Advanced Semiconductor Engineering, Inc.
- Ying-Xu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,011,496
- Issue date May 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 10,840,219
- Issue date Nov 17, 2020
- Advanced Semiconductor Engineering, Inc.
- Bo-Syun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,770,369
- Issue date Sep 8, 2020
- Advanced Semiconductor Engineering, Inc.
- Chih-Pin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,586,716
- Issue date Mar 10, 2020
- Advanced Semiconductor Engineering, Inc.
- Ying-Xu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 10,332,862
- Issue date Jun 25, 2019
- Advanced Semiconductor Engineering, Inc.
- Bo-Syun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having an underfill barrier
- Patent number 10,217,649
- Issue date Feb 26, 2019
- Advanced Semiconductor Engineering, Inc.
- Jin-Yuan Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 9,589,871
- Issue date Mar 7, 2017
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer substrate, semiconductor structure and fabricating proce...
- Patent number 9,478,500
- Issue date Oct 25, 2016
- Advanced Semiconductor Engineering, Inc.
- Chia-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20230411349
- Publication date Dec 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230207729
- Publication date Jun 29, 2023
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE
- Publication number 20210327796
- Publication date Oct 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210288024
- Publication date Sep 16, 2021
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210280744
- Publication date Sep 9, 2021
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210074676
- Publication date Mar 11, 2021
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200381338
- Publication date Dec 3, 2020
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200211863
- Publication date Jul 2, 2020
- Advanced Semiconductor Engineering, Inc.
- Ying-Xu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200066612
- Publication date Feb 27, 2020
- Advanced Semiconductor Engineering, Inc.
- Chih-Pin HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190287947
- Publication date Sep 19, 2019
- Advanced Semiconductor Engineering, Inc.
- Bo-Syun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190074264
- Publication date Mar 7, 2019
- Advanced Semiconductor Engineering, Inc.
- Bo-Syun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20180358237
- Publication date Dec 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Ying-Xu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING AN UNDERFILL BARRIER
- Publication number 20180358238
- Publication date Dec 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Jin-Yuan LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160300782
- Publication date Oct 13, 2016
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER SUBSTRATE, SEMICONDUCTOR STRUCTURE AND FABRICATING PROCE...
- Publication number 20160240481
- Publication date Aug 18, 2016
- Advanced Semiconductor Engineering, Inc.
- Chia-Ching CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Tang-Yuan CHEN

Person

Patents Grantslast 30 patents

Semiconductor device packages and methods of manufacturing the same

Semiconductor device packages and methods of manufacturing the same

Semiconductor device package

Wiring structure

Semiconductor device package having continously formed tapered prot...

Semiconductor device packages and methods of manufacturing the same

Semiconductor package structure and method for manufacturing the same

Semiconductor device package

Semiconductor device package

Semiconductor package structure and method for manufacturing the same

Semiconductor device package having an underfill barrier

Semiconductor package structure and method for manufacturing the same

Interposer substrate, semiconductor structure and fabricating proce...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

WIRING STRUCTURE

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE HAVING AN UNDERFILL BARRIER

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

INTERPOSER SUBSTRATE, SEMICONDUCTOR STRUCTURE AND FABRICATING PROCE...