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Tanja Braun
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Berlin, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Waver-level packaging based module and method for producing the same
Patent number
11,328,987
Issue date
May 10, 2022
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
Ivan Ndip
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level package with integrated antennas and means for shielding
Patent number
10,978,778
Issue date
Apr 13, 2021
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
Ivan Ndip
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level package with at least one integrated antenna element
Patent number
10,797,375
Issue date
Oct 6, 2020
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
Ivan Ndip
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level package with integrated or embedded antenna
Patent number
10,461,399
Issue date
Oct 29, 2019
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
Ivan Ndip
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level package with integrated or embedded antenna
Patent number
10,424,827
Issue date
Sep 24, 2019
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
Ivan Ndip
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing an electronic component and an electronic...
Patent number
10,403,576
Issue date
Sep 3, 2019
Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
Tanja Braun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing encapsulated chips
Patent number
7,011,989
Issue date
Mar 14, 2006
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
Karl-Friedrich Becker
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
WAVER-LEVEL PACKAGING BASED MODULE AND METHOD FOR PRODUCING THE SAME
Publication number
20200176376
Publication date
Jun 4, 2020
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
Ivan NDIP
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL PACKAGE WITH INTEGRATED ANTENNAS AND MEANS FOR SHIELDING
Publication number
20180191052
Publication date
Jul 5, 2018
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
Ivan NDIP
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL PACKAGE WITH INTEGRATED OR EMBEDDED ANTENNA
Publication number
20180191053
Publication date
Jul 5, 2018
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
Ivan NDIP
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL PACKAGE WITH AT LEAST ONE INTEGRATED ANTENNA ELEMENT
Publication number
20180191051
Publication date
Jul 5, 2018
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
Ivan NDIP
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC COMPONENT AND AN ELECTRONIC...
Publication number
20170098611
Publication date
Apr 6, 2017
Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
Tanja Braun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for producing encapsulated chips
Publication number
20040110323
Publication date
Jun 10, 2004
Karl-Friedrich Becker
H01 - BASIC ELECTRIC ELEMENTS