Tannaz Harirchian

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermally-optimized tunable stack in cavity package-on-package
- Patent number 11,769,753
- Issue date Sep 26, 2023
- Intel Corporation
- George Vakanas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of molded packages
- Patent number 10,424,559
- Issue date Sep 24, 2019
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumpless build-up layer package including an integrated heat spreader
- Patent number 9,520,376
- Issue date Dec 13, 2016
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumpless build-up layer package including an integrated heat spreader
- Patent number 9,153,552
- Issue date Oct 6, 2015
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumpless build-up layer package including an integrated heat spreader
- Patent number 8,912,670
- Issue date Dec 16, 2014
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STANDOFF MEMBERS FOR SEMICONDUCTOR PACKAGE
- Publication number 20200066654
- Publication date Feb 27, 2020
- Intel IP Corporation
- Je-Young CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY-OPTIMIZED TUNABLE STACK IN CAVITY PACKAGE-ON-PACKAGE
- Publication number 20200043894
- Publication date Feb 6, 2020
- Intel Corporation
- George VAKANAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDOFF MEMBERS FOR SEMICONDUCTOR PACKAGE
- Publication number 20180190596
- Publication date Jul 5, 2018
- Intel Corporation
- Je-Young G. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Management of Molded Packages
- Publication number 20180182736
- Publication date Jun 28, 2018
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY STORAGE MATERIAL FOR THERMAL MANAGEMENT AND ASSOCIATED TECHN...
- Publication number 20180068926
- Publication date Mar 8, 2018
- Intel Corporation
- JAN KRAJNIAK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING AN INTEGRATED HEAT SPREADER
- Publication number 20160027757
- Publication date Jan 28, 2016
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING AN INTEGRATED HEAT SPREADER
- Publication number 20150104907
- Publication date Apr 16, 2015
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING AN INTEGRATED HEAT SPREADER
- Publication number 20140091445
- Publication date Apr 3, 2014
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS

Tannaz Harirchian

Person

Patents Grantslast 30 patents

Thermally-optimized tunable stack in cavity package-on-package

Thermal management of molded packages

Bumpless build-up layer package including an integrated heat spreader

Bumpless build-up layer package including an integrated heat spreader

Bumpless build-up layer package including an integrated heat spreader

Patents Applicationslast 30 patents

STANDOFF MEMBERS FOR SEMICONDUCTOR PACKAGE

THERMALLY-OPTIMIZED TUNABLE STACK IN CAVITY PACKAGE-ON-PACKAGE

STANDOFF MEMBERS FOR SEMICONDUCTOR PACKAGE

Thermal Management of Molded Packages

ENERGY STORAGE MATERIAL FOR THERMAL MANAGEMENT AND ASSOCIATED TECHN...

BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING AN INTEGRATED HEAT SPREADER

BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING AN INTEGRATED HEAT SPREADER

BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING AN INTEGRATED HEAT SPREADER