Tanya Andreeva ATANASOVA

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Dresden, DE

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Patents Grantslast 30 patents

Information Patent Grant
Etching of under bump mettallization layer and resulting device
- Patent number 9,214,436
- Issue date Dec 15, 2015
- GLOBALFOUNDRIES Inc.
- Tanya Andreeva Atanasova
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for etching copper during the fabrication of integrated cir...
- Patent number 9,159,683
- Issue date Oct 13, 2015
- GLOBALFOUNDRIES, INC.
- Reiner Willeke
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ETCHING OF UNDER BUMP METALLIZATION LAYER AND RESULTING DEVICE
- Publication number 20160043046
- Publication date Feb 11, 2016
- GLOBALFOUNDRIES INC.
- Tanya Andreeva ATANASOVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ETCHING COPPER DURING THE FABRICATION OF INTEGRATED CIR...
- Publication number 20150228595
- Publication date Aug 13, 2015
- INTERMOLECULAR INC.
- Reiner Willeke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING OF UNDER BUMP METTALLIZATION LAYER AND RESULTING DEVICE
- Publication number 20150221605
- Publication date Aug 6, 2015
- GLOBALFOUNDRIES INC.
- Tanya Andreeva ATANASOVA
- H01 - BASIC ELECTRIC ELEMENTS