Tao Chen

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Wafer cutting method and a system thereof
- Patent number 8,847,104
- Issue date Sep 30, 2014
- Agency for Science Technology and Research
- Zhongke Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WAFER CUTTING METHOD AND A SYSTEM THEREOF
- Publication number 20110244659
- Publication date Oct 6, 2011
- Agency for Science, Technology and Research
- Zhongke Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR