Tao Cheng

Person

Hsin Chu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with layer structures, antenna layer and elec...
- Patent number 11,837,552
- Issue date Dec 5, 2023
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with layer structures, antenna layer and elec...
- Patent number 11,373,957
- Issue date Jun 28, 2022
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,784,206
- Issue date Sep 22, 2020
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package structure
- Patent number 10,354,974
- Issue date Jul 16, 2019
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor device using the same
- Patent number 10,312,222
- Issue date Jun 4, 2019
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package and manufacturing met...
- Patent number 10,186,488
- Issue date Jan 22, 2019
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power and ground routing of integrated circuit devices with improve...
- Patent number 10,002,833
- Issue date Jun 19, 2018
- Mediatek Inc.
- Ching-Chung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite solder ball, semiconductor package using the same, semico...
- Patent number 9,908,203
- Issue date Mar 6, 2018
- Mediatek Inc.
- Tao Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit stress releasing structure
- Patent number 9,905,515
- Issue date Feb 27, 2018
- Mediatek Inc.
- Chin-Chiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device using the same and manu...
- Patent number 9,881,902
- Issue date Jan 30, 2018
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device using the same and manu...
- Patent number 9,761,534
- Issue date Sep 12, 2017
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power and ground routing of integrated circuit devices with improve...
- Patent number 9,698,102
- Issue date Jul 4, 2017
- Mediatek Inc.
- Ching-Chung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite solder ball, semiconductor package using the same, semico...
- Patent number 9,597,752
- Issue date Mar 21, 2017
- Mediatek Inc.
- Tao Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power and ground routing of integrated circuit devices with improve...
- Patent number 9,379,059
- Issue date Jun 28, 2016
- Mediatek Inc.
- Ching-Chung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe for semiconductor packages
- Patent number 9,198,281
- Issue date Nov 24, 2015
- Mediatek Inc.
- Tao Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated inductor
- Patent number 8,860,544
- Issue date Oct 14, 2014
- MediaTek Inc.
- Ching-Chung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-voltage metal-oxide-semiconductor device
- Patent number 8,587,056
- Issue date Nov 19, 2013
- MediaTek Inc.
- Ming-Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip with seal ring structure
- Patent number 8,242,586
- Issue date Aug 14, 2012
- MediaTek Inc.
- Tien-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure
- Patent number 8,138,616
- Issue date Mar 20, 2012
- MediaTek Inc.
- Tien-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power and ground routing of integrated circuit devices with improve...
- Patent number 8,120,067
- Issue date Feb 21, 2012
- MediaTek Inc.
- Ching-Chung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power and ground routing of integrated circuit devices with improve...
- Patent number 8,072,004
- Issue date Dec 6, 2011
- MediaTek Inc.
- Ching-Chung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection device in high voltage and manufacturing method for...
- Patent number 8,044,466
- Issue date Oct 25, 2011
- Mediatek Inc.
- Ding-Jeng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection circuit and method thereof
- Patent number 8,023,237
- Issue date Sep 20, 2011
- MediaTek Inc.
- I-Cheng Lin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Lateral bipolar junction transistor with reduced base resistance
- Patent number 7,897,995
- Issue date Mar 1, 2011
- MediaTek Inc.
- Ming-Tzong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection device
- Patent number 7,894,170
- Issue date Feb 22, 2011
- Mediatek Incorporation
- Hsueh-Kun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
NPN Darlington ESD protection circuit
- Patent number 7,880,234
- Issue date Feb 1, 2011
- MediaTek Inc.
- Tao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power and ground routing of integrated circuit devices with improve...
- Patent number 7,821,038
- Issue date Oct 26, 2010
- MediaTek Inc.
- Ching-Chung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiGe device with SiGe-embedded dummy pattern for alleviating micro-...
- Patent number 7,671,469
- Issue date Mar 2, 2010
- Mediatek Inc.
- Tung-Hsing Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip with seal ring structure
- Patent number 7,667,302
- Issue date Feb 23, 2010
- Mediatek Inc.
- Tien-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection circuit for electro static discharge
- Patent number 7,532,446
- Issue date May 12, 2009
- Mediatek Inc.
- Tao Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH LAYER STRUCTURES, ANTENNA LAYER AND ELEC...
- Publication number 20220352084
- Publication date Nov 3, 2022
- MEDIATEK INC.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200381365
- Publication date Dec 3, 2020
- MEDIATEK INC.
- Wen-Sung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190051609
- Publication date Feb 14, 2019
- MEDIATEK INC.
- Wen-Sung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE USING THE SAME
- Publication number 20180114779
- Publication date Apr 26, 2018
- MEDIATEK INC.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE AND MANUFACTURING MET...
- Publication number 20170338183
- Publication date Nov 23, 2017
- MEDIATEK INC.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AND GROUND ROUTING OF INTEGRATED CIRCUIT DEVICES WITH IMPROVE...
- Publication number 20170263559
- Publication date Sep 14, 2017
- MEDIATEK INC.
- Ching-Chung KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SOLDER BALL, SEMICONDUCTOR PACKAGE USING THE SAME, SEMICO...
- Publication number 20170136582
- Publication date May 18, 2017
- MEDIATEK INC.
- Tao Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE USING THE SAME AND MANU...
- Publication number 20170084541
- Publication date Mar 23, 2017
- MEDIATEK INC.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE USING THE SAME AND MANU...
- Publication number 20170040292
- Publication date Feb 9, 2017
- MEDIATEK INC.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AND GROUND ROUTING OF INTEGRATED CIRCUIT DEVICES WITH IMPROVE...
- Publication number 20160276274
- Publication date Sep 22, 2016
- MEDIATEK INC.
- Ching-Chung KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SOLDER BALL, SEMICONDUCTOR PACKAGE USING THE SAME, SEMICO...
- Publication number 20160263709
- Publication date Sep 15, 2016
- MEDIATEK INC.
- Tao Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE
- Publication number 20160172334
- Publication date Jun 16, 2016
- MEDIATEK INC.
- Wen-Sung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR ADAPTIVE THERMAL ANALYSIS
- Publication number 20160153922
- Publication date Jun 2, 2016
- MEDIATEK INC.
- Yu-Min LEE
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT STRESS RELEASING STRUCTURE
- Publication number 20160043040
- Publication date Feb 11, 2016
- MEDIATEK INC.
- Chin-Chiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INCLUDING DECOUPLING CAPACITORS INTO SEMICONDUCTOR CIRCU...
- Publication number 20150001675
- Publication date Jan 1, 2015
- MEDIATEK INC.
- Tien-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INCLUDING DECOUPLING CAPACITORS INTO SEMICONDUCTOR CIRCU...
- Publication number 20140175608
- Publication date Jun 26, 2014
- MEDIATEK INC.
- Tien-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME FOR SEMICONDUCTOR PACKAGES
- Publication number 20140097012
- Publication date Apr 10, 2014
- MEDIATEK INC.
- Tao Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH-VOLTAGE METAL-OXIDE-SEMICONDUCTOR DEVICE
- Publication number 20120168862
- Publication date Jul 5, 2012
- Ming-Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AND GROUND ROUTING OF INTEGRATED CIRCUIT DEVICES WITH IMPROVE...
- Publication number 20120043663
- Publication date Feb 23, 2012
- Ching-Chung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AND GROUND ROUTING OF INTEGRATED CIRCUIT DEVICES WITH IMPROVE...
- Publication number 20120038055
- Publication date Feb 16, 2012
- Ching-Chung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AND GROUND ROUTING OF INTEGRATED CIRCUIT DEVICES WITH IMPROVE...
- Publication number 20110001168
- Publication date Jan 6, 2011
- Ching-Chung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CAPACITOR
- Publication number 20100289119
- Publication date Nov 18, 2010
- Tao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL BIPOLAR JUNCTION TRANSISTOR WITH REDUCED BASE RESISTANCE
- Publication number 20100252860
- Publication date Oct 7, 2010
- Ming-Tzong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME FOR SEMICONDUCTOR PACKAGES
- Publication number 20100193925
- Publication date Aug 5, 2010
- MEDIATEK INC.
- Tao Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH-VOLTAGE METAL-OXIDE-SEMICONDUCTOR DEVICE
- Publication number 20100164018
- Publication date Jul 1, 2010
- Ming-Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP WITH SEAL RING STRUCTURE
- Publication number 20100102421
- Publication date Apr 29, 2010
- Tien-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INCLUDING DECOUPLING CAPACITORS INTO SEMICONDUCTOR CIRCU...
- Publication number 20100065943
- Publication date Mar 18, 2010
- Tien-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP WITH SEAL RING STRUCTURE
- Publication number 20100059867
- Publication date Mar 11, 2010
- Tien-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESD PROTECTION CIRCUIT AND METHOD THEREOF
- Publication number 20100061026
- Publication date Mar 11, 2010
- I-Cheng Lin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
INTEGRATED CAPACITOR
- Publication number 20100044833
- Publication date Feb 25, 2010
- Tao Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package with layer structures, antenna layer and elec...

Semiconductor package with layer structures, antenna layer and elec...

Semiconductor package

Structure and formation method of chip package structure

Semiconductor package and semiconductor device using the same

Manufacturing method of semiconductor package and manufacturing met...

Power and ground routing of integrated circuit devices with improve...

Composite solder ball, semiconductor package using the same, semico...

Integrated circuit stress releasing structure

Semiconductor package, semiconductor device using the same and manu...

Semiconductor package, semiconductor device using the same and manu...

Power and ground routing of integrated circuit devices with improve...

Composite solder ball, semiconductor package using the same, semico...

Power and ground routing of integrated circuit devices with improve...

Leadframe for semiconductor packages

Integrated inductor

High-voltage metal-oxide-semiconductor device

Integrated circuit chip with seal ring structure

Bond pad structure

Power and ground routing of integrated circuit devices with improve...

Power and ground routing of integrated circuit devices with improve...

ESD protection device in high voltage and manufacturing method for...

ESD protection circuit and method thereof

Lateral bipolar junction transistor with reduced base resistance

ESD protection device

NPN Darlington ESD protection circuit

Power and ground routing of integrated circuit devices with improve...

SiGe device with SiGe-embedded dummy pattern for alleviating micro-...

Integrated circuit chip with seal ring structure

Protection circuit for electro static discharge

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH LAYER STRUCTURES, ANTENNA LAYER AND ELEC...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE USING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE AND MANUFACTURING MET...

POWER AND GROUND ROUTING OF INTEGRATED CIRCUIT DEVICES WITH IMPROVE...

COMPOSITE SOLDER BALL, SEMICONDUCTOR PACKAGE USING THE SAME, SEMICO...

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE USING THE SAME AND MANU...

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE USING THE SAME AND MANU...

POWER AND GROUND ROUTING OF INTEGRATED CIRCUIT DEVICES WITH IMPROVE...

COMPOSITE SOLDER BALL, SEMICONDUCTOR PACKAGE USING THE SAME, SEMICO...

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE

SYSTEM AND METHOD FOR ADAPTIVE THERMAL ANALYSIS

INTEGRATED CIRCUIT STRESS RELEASING STRUCTURE

METHOD FOR INCLUDING DECOUPLING CAPACITORS INTO SEMICONDUCTOR CIRCU...

METHOD FOR INCLUDING DECOUPLING CAPACITORS INTO SEMICONDUCTOR CIRCU...

LEADFRAME FOR SEMICONDUCTOR PACKAGES

HIGH-VOLTAGE METAL-OXIDE-SEMICONDUCTOR DEVICE

POWER AND GROUND ROUTING OF INTEGRATED CIRCUIT DEVICES WITH IMPROVE...

POWER AND GROUND ROUTING OF INTEGRATED CIRCUIT DEVICES WITH IMPROVE...

POWER AND GROUND ROUTING OF INTEGRATED CIRCUIT DEVICES WITH IMPROVE...

INTEGRATED CAPACITOR

LATERAL BIPOLAR JUNCTION TRANSISTOR WITH REDUCED BASE RESISTANCE

LEADFRAME FOR SEMICONDUCTOR PACKAGES

HIGH-VOLTAGE METAL-OXIDE-SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT CHIP WITH SEAL RING STRUCTURE

METHOD FOR INCLUDING DECOUPLING CAPACITORS INTO SEMICONDUCTOR CIRCU...

INTEGRATED CIRCUIT CHIP WITH SEAL RING STRUCTURE

ESD PROTECTION CIRCUIT AND METHOD THEREOF

INTEGRATED CAPACITOR