Tao Feng

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Vertical semiconductor MOSFET device with double substrate-side mul...
- Patent number 9,355,953
- Issue date May 31, 2016
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrateless power device packages
- Patent number 9,136,154
- Issue date Sep 15, 2015
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrateless power device packages
- Patent number 8,987,878
- Issue date Mar 24, 2015
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale package and process of manufacture
- Patent number 8,981,464
- Issue date Mar 17, 2015
- Alpha and Omega Semiconductor Ltd.
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with substrate-side exposed device-side electr...
- Patent number 8,866,267
- Issue date Oct 21, 2014
- Alpha & Omega Semiconductor, Inc.
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for ultra thin wafer backside processing
- Patent number 8,846,532
- Issue date Sep 30, 2014
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- B32 - LAYERED PRODUCTS
Information Patent Grant
Virtually substrate-less composite power semiconductor device
- Patent number 8,796,858
- Issue date Aug 5, 2014
- Alpha & Omega Semiconductor, Inc.
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale package and process of manufacture
- Patent number 8,716,063
- Issue date May 6, 2014
- Alpha and Omega Semiconductor Ltd.
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming ultra thin wafers having an edge support ring
- Patent number 8,507,362
- Issue date Aug 13, 2013
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stackable power MOSFET, power MOSFET stack, and process of manufacture
- Patent number 8,466,060
- Issue date Jun 18, 2013
- Alpha & Omega Semiconductor, Inc.
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configuration of high-voltage semiconductor power device to achieve...
- Patent number 8,461,004
- Issue date Jun 11, 2013
- Alpha and Omega Semiconductor Incorporated
- François Hébert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro surface mount device packaging
- Patent number 8,450,151
- Issue date May 28, 2013
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale packaging
- Patent number 8,426,960
- Issue date Apr 23, 2013
- Alpha & Omega Semiconductor, Inc.
- Ming Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for ultra thin wafer backside processing
- Patent number 8,361,903
- Issue date Jan 29, 2013
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- B24 - GRINDING POLISHING
Information Patent Grant
Chip scale surface mounted semiconductor device package and process...
- Patent number 8,294,254
- Issue date Oct 23, 2012
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Virtually substrate-less composite power semiconductor device and m...
- Patent number 8,242,013
- Issue date Aug 14, 2012
- Alpha and Omega Semiconductor Inc.
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale surface mounted semiconductor device package and process...
- Patent number 8,222,078
- Issue date Jul 17, 2012
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact inductive power electronics package
- Patent number 8,217,748
- Issue date Jul 10, 2012
- Alpha and Omega Semiconductor Inc.
- Tao Feng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Lead frame-based discrete power inductor
- Patent number 8,058,961
- Issue date Nov 15, 2011
- Alpha and Omega Semiconductor Incorporated
- François Hébert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standing chip scale package
- Patent number 8,058,727
- Issue date Nov 15, 2011
- Alpha and Omega Semiconductor Incorporation
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standing chip scale package
- Patent number 8,053,891
- Issue date Nov 8, 2011
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming ultra thin wafers having an edge support ring
- Patent number 8,048,775
- Issue date Nov 1, 2011
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Configuration of high-voltage semiconductor power device to achieve...
- Patent number 7,977,740
- Issue date Jul 12, 2011
- Alpha and Omega Semiconductor Incorporated
- François Hébert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar grooved power inductor structure and method
- Patent number 7,971,340
- Issue date Jul 5, 2011
- Alpha and Omega Semiconductor, Ltd.
- Francois Hébert
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer level chip scale package and process of manufacture
- Patent number 7,955,893
- Issue date Jun 7, 2011
- Alpha and Omega Semiconductor, Ltd.
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar grooved power inductor structure and method
- Patent number 7,948,346
- Issue date May 24, 2011
- Alpha and Omega Semiconductor, Ltd.
- Francois Hébert
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor power device package having a lead frame-based integr...
- Patent number 7,884,452
- Issue date Feb 8, 2011
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame-based discrete power inductor
- Patent number 7,884,696
- Issue date Feb 8, 2011
- Alpha and Omega Semiconductor Incorporated
- François Hébert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact power semiconductor package and method with stacked inducto...
- Patent number 7,868,431
- Issue date Jan 11, 2011
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale package and method of laser marking the same
- Patent number 7,842,543
- Issue date Nov 30, 2010
- Alpha and Omega Semiconductor Incorporated
- Ruisheng Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATELESS POWER DEVICE PACKAGES
- Publication number 20150340301
- Publication date Nov 26, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATELESS POWER DEVICE PACKAGES
- Publication number 20150056752
- Publication date Feb 26, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical Semiconductor MOSFET Device with Double Substrate-Side Mul...
- Publication number 20150035049
- Publication date Feb 5, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE AND PROCESS OF MANUFACTURE
- Publication number 20140239383
- Publication date Aug 28, 2014
- ALPHA & OMEGA SEMICONDUCTOR, LTD.
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ULTRA THIN WAFER BACKSIDE PROCESSING
- Publication number 20140076846
- Publication date Mar 20, 2014
- Tao Feng
- B32 - LAYERED PRODUCTS
Information Patent Application
FABRICATION METHOD OF A MIXED ALLOY LEAD FRAME FOR PACKAGING POWER...
- Publication number 20130273697
- Publication date Oct 17, 2013
- Zhi Qiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO SURFACE MOUNT DEVICE PACKAGING
- Publication number 20130127043
- Publication date May 23, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO SURFACE MOUNT DEVICE PACKAGING
- Publication number 20130127044
- Publication date May 23, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE PACKAGE AND METHOD
- Publication number 20120326300
- Publication date Dec 27, 2012
- National Semiconductor Corporation
- Tao FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Virtually Substrate-less Composite Power Semiconductor Device
- Publication number 20120235306
- Publication date Sep 20, 2012
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP SCALE PACKAGING OF METAL-OXIDE-SEMICONDUCTOR FIELD...
- Publication number 20120202320
- Publication date Aug 9, 2012
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGE AND PROCESS...
- Publication number 20120161307
- Publication date Jun 28, 2012
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATELESS POWER DEVICE PACKAGES
- Publication number 20120104580
- Publication date May 3, 2012
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Substrate-Side Exposed Device-Side Electr...
- Publication number 20110291245
- Publication date Dec 1, 2011
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable Power MOSFET, Power MOSFET Stack, and Process of Manufacture
- Publication number 20110266683
- Publication date Nov 3, 2011
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Virtually Substrate-less Composite Power Semiconductor Device and M...
- Publication number 20110241214
- Publication date Oct 6, 2011
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process of forming ultra thin wafers having an edge support ring
- Publication number 20110223742
- Publication date Sep 15, 2011
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Configuration of high-voltage semiconductor power device to achieve...
- Publication number 20110201174
- Publication date Aug 18, 2011
- Alpha and Omega Semiconductor Incorporated
- François Hébert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Frame-based Discrete Power Inductor
- Publication number 20110121934
- Publication date May 26, 2011
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR GROOVED POWER INDUCTOR STRUCTURE AND METHOD
- Publication number 20110107589
- Publication date May 12, 2011
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE AND PROCESS OF MANUFACTURE
- Publication number 20110108896
- Publication date May 12, 2011
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- TAO FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED ALLOY LEAD FRAME FOR PACKAGING POWER SEMICONDUCTOR DEVICES AN...
- Publication number 20110073999
- Publication date Mar 31, 2011
- Zhi Qiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGE AND PROCESS...
- Publication number 20110018116
- Publication date Jan 27, 2011
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulated Gate Bipolar Transistor (IGBT) Collector Formed with Ge/A...
- Publication number 20100327314
- Publication date Dec 30, 2010
- Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDING CHIP SCALE PACKAGE
- Publication number 20100320531
- Publication date Dec 23, 2010
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ULTRA THIN WAFER BACKSIDE PROCESSING
- Publication number 20100221431
- Publication date Sep 2, 2010
- Tao Feng
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Wafer level chip scale package and method of laser marking the same
- Publication number 20100207283
- Publication date Aug 19, 2010
- Ruisheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Configuration of high-voltage semiconductor power device to achieve...
- Publication number 20100155878
- Publication date Jun 24, 2010
- Alpha and Omega Semiconductor Incorporated
- François Hébert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Standing chip scale package
- Publication number 20090321929
- Publication date Dec 31, 2009
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR GROOVED POWER INDUCTOR STRUCTURE AND METHOD
- Publication number 20090322461
- Publication date Dec 31, 2009
- ALPHA & OMEGA SEMICONDUCTOR, LTD.
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Vertical semiconductor MOSFET device with double substrate-side mul...

Substrateless power device packages

Substrateless power device packages

Wafer level chip scale package and process of manufacture

Semiconductor device with substrate-side exposed device-side electr...

Method and apparatus for ultra thin wafer backside processing

Virtually substrate-less composite power semiconductor device

Wafer level chip scale package and process of manufacture

Process of forming ultra thin wafers having an edge support ring

Stackable power MOSFET, power MOSFET stack, and process of manufacture

Configuration of high-voltage semiconductor power device to achieve...

Micro surface mount device packaging

Wafer level chip scale packaging

Method and apparatus for ultra thin wafer backside processing

Chip scale surface mounted semiconductor device package and process...

Virtually substrate-less composite power semiconductor device and m...

Chip scale surface mounted semiconductor device package and process...

Compact inductive power electronics package

Lead frame-based discrete power inductor

Standing chip scale package

Standing chip scale package

Process of forming ultra thin wafers having an edge support ring

Configuration of high-voltage semiconductor power device to achieve...

Planar grooved power inductor structure and method

Wafer level chip scale package and process of manufacture

Planar grooved power inductor structure and method

Semiconductor power device package having a lead frame-based integr...

Lead frame-based discrete power inductor

Compact power semiconductor package and method with stacked inducto...

Wafer level chip scale package and method of laser marking the same

Patents Applicationslast 30 patents

SUBSTRATELESS POWER DEVICE PACKAGES

SUBSTRATELESS POWER DEVICE PACKAGES

Vertical Semiconductor MOSFET Device with Double Substrate-Side Mul...

WAFER LEVEL CHIP SCALE PACKAGE AND PROCESS OF MANUFACTURE

METHOD AND APPARATUS FOR ULTRA THIN WAFER BACKSIDE PROCESSING

FABRICATION METHOD OF A MIXED ALLOY LEAD FRAME FOR PACKAGING POWER...

MICRO SURFACE MOUNT DEVICE PACKAGING

MICRO SURFACE MOUNT DEVICE PACKAGING

LOW PROFILE PACKAGE AND METHOD

Virtually Substrate-less Composite Power Semiconductor Device

WAFER-LEVEL CHIP SCALE PACKAGING OF METAL-OXIDE-SEMICONDUCTOR FIELD...

CHIP SCALE SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGE AND PROCESS...

SUBSTRATELESS POWER DEVICE PACKAGES

Semiconductor Device with Substrate-Side Exposed Device-Side Electr...

Stackable Power MOSFET, Power MOSFET Stack, and Process of Manufacture

Virtually Substrate-less Composite Power Semiconductor Device and M...

Process of forming ultra thin wafers having an edge support ring

Configuration of high-voltage semiconductor power device to achieve...

Lead Frame-based Discrete Power Inductor

PLANAR GROOVED POWER INDUCTOR STRUCTURE AND METHOD

WAFER LEVEL CHIP SCALE PACKAGE AND PROCESS OF MANUFACTURE

MIXED ALLOY LEAD FRAME FOR PACKAGING POWER SEMICONDUCTOR DEVICES AN...

CHIP SCALE SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGE AND PROCESS...

Insulated Gate Bipolar Transistor (IGBT) Collector Formed with Ge/A...

STANDING CHIP SCALE PACKAGE

METHOD AND APPARATUS FOR ULTRA THIN WAFER BACKSIDE PROCESSING

Wafer level chip scale package and method of laser marking the same

Configuration of high-voltage semiconductor power device to achieve...

Standing chip scale package

PLANAR GROOVED POWER INDUCTOR STRUCTURE AND METHOD