Tao Liu

Person

Dupont, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated package insertion and loading mechanism (iPILM)
- Patent number 9,496,630
- Issue date Nov 15, 2016
- Intel Corporation
- Tao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated package insertion and loading mechanism (iPILM)
- Patent number 9,231,318
- Issue date Jan 5, 2016
- Intel Corporation
- Tao Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a wound capacitor
- Patent number 7,496,997
- Issue date Mar 3, 2009
- Intel Corporation
- Aaron J. Steyskal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wound capacitor
- Patent number 7,042,702
- Issue date May 9, 2006
- Intel Corporation
- Aaron J. Steyskal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selectable capacitance apparatus and methods
- Patent number 7,030,460
- Issue date Apr 18, 2006
- Intel Corporation
- Peir Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a wound capacitor
- Patent number 6,862,784
- Issue date Mar 8, 2005
- Intel Corporation
- Tao Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple electrode capacitor
- Patent number 6,785,118
- Issue date Aug 31, 2004
- Intel Corporation
- Tao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered polymer on aluminum stacked capacitor
- Patent number 6,751,087
- Issue date Jun 15, 2004
- Intel Corporation
- Mike Greenwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient termination for wound capacitors
- Patent number 6,704,187
- Issue date Mar 9, 2004
- Intel Corporation
- Steve Schiveley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered polymer on aluminum stacked capacitor
- Patent number 6,590,762
- Issue date Jul 8, 2003
- Intel Corporation
- Mike Greenwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple terminal SMT BGA-style wound capacitor
- Patent number 6,529,365
- Issue date Mar 4, 2003
- Intel Corporation
- Tao Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid dielectric material and hybrid dielectric capacitor
- Patent number 6,519,136
- Issue date Feb 11, 2003
- Intel Corporation
- Peir Chu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP SELF ADJUSTING COOLING SOLUTION
- Publication number 20160276243
- Publication date Sep 22, 2016
- Jeffory L. SMALLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGE INSERTION AND LOADING MECHANISM (iPILM)
- Publication number 20160190740
- Publication date Jun 30, 2016
- Intel Corporation
- Tao LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GASKETTED THERMAL INTERFACE
- Publication number 20150184053
- Publication date Jul 2, 2015
- SHANKAR KRISHNAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED PACKAGE INSERTION AND LOADING MECHANISM (iPILM)
- Publication number 20140199873
- Publication date Jul 17, 2014
- Intel Corporation
- Tao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wound capacitor
- Publication number 20060145360
- Publication date Jul 6, 2006
- Aaron J. Steyskal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wound capacitor
- Publication number 20050128677
- Publication date Jun 16, 2005
- Aaron J. Steyskal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Selectable capacitance apparatus and methods
- Publication number 20040007759
- Publication date Jan 15, 2004
- Intel Corporation
- Peir Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered polymer on aluminum stacked capacitor
- Publication number 20030137800
- Publication date Jul 24, 2003
- Intel Corporation
- Mike Greenwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple terminal SMT BGA-style wound capacitor
- Publication number 20030103317
- Publication date Jun 5, 2003
- Tao Liu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Efficient termination for wound capacitors
- Publication number 20030058603
- Publication date Mar 27, 2003
- Steve Schiveley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered polymer on aluminum stacked capacitor
- Publication number 20030026058
- Publication date Feb 6, 2003
- Intel Corporation
- Mike Greenwood
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated package insertion and loading mechanism (iPILM)

Integrated package insertion and loading mechanism (iPILM)

Method for making a wound capacitor

Wound capacitor

Selectable capacitance apparatus and methods

Method of fabricating a wound capacitor

Multiple electrode capacitor

Layered polymer on aluminum stacked capacitor

Efficient termination for wound capacitors

Layered polymer on aluminum stacked capacitor

Multiple terminal SMT BGA-style wound capacitor

Hybrid dielectric material and hybrid dielectric capacitor

Patents Applicationslast 30 patents

MULTI-CHIP SELF ADJUSTING COOLING SOLUTION

INTEGRATED PACKAGE INSERTION AND LOADING MECHANISM (iPILM)

GASKETTED THERMAL INTERFACE

INTEGRATED PACKAGE INSERTION AND LOADING MECHANISM (iPILM)

Wound capacitor

Wound capacitor

Selectable capacitance apparatus and methods

Layered polymer on aluminum stacked capacitor

Multiple terminal SMT BGA-style wound capacitor

Efficient termination for wound capacitors

Layered polymer on aluminum stacked capacitor