Tao Su

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip package
- Patent number 7,605,020
- Issue date Oct 20, 2009
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stacking package method
- Patent number 7,473,581
- Issue date Jan 6, 2009
- Advanced Semiconductor Engineering Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 7,321,168
- Issue date Jan 22, 2008
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package structure
- Patent number 7,291,926
- Issue date Nov 6, 2007
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package structure
- Patent number 7,253,529
- Issue date Aug 7, 2007
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for sawing substrate strip
- Patent number 7,168,352
- Issue date Jan 30, 2007
- Advanced Semiconductor Engineering, Inc.
- Jau-Yuen Su
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip package
- Patent number 7,151,308
- Issue date Dec 19, 2006
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat non-leaded package
- Patent number 7,141,867
- Issue date Nov 28, 2006
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package structure
- Patent number 7,129,583
- Issue date Oct 31, 2006
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless semiconductor package
- Patent number 7,102,241
- Issue date Sep 5, 2006
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package structure
- Patent number 7,064,428
- Issue date Jun 20, 2006
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 7,037,759
- Issue date May 2, 2006
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 7,023,082
- Issue date Apr 4, 2006
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromachine package and method for manufacturing the same
- Patent number 7,009,302
- Issue date Mar 7, 2006
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermal enhance MCM package and manufacturing method thereof
- Patent number 7,002,805
- Issue date Feb 21, 2006
- Advanced Semiconductor Engineering Inc.
- Shih-Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical component package and packaging including an optical compon...
- Patent number 7,002,257
- Issue date Feb 21, 2006
- Advanced Semiconductor Engineering Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump fabrication process
- Patent number 6,967,153
- Issue date Nov 22, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level package structure with a heat slug
- Patent number 6,946,729
- Issue date Sep 20, 2005
- Advanced Semiconductor Engineering, Inc.
- Chun-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bumping process with solder balls bonded to under bump metall...
- Patent number 6,939,790
- Issue date Sep 6, 2005
- Advanced Semiconductor Engineering, Inc.
- Jau-Shoung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 6,933,605
- Issue date Aug 23, 2005
- Advanced Semiconductor Engineering Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for preventing burnt fuse pad from further electrical con...
- Patent number 6,927,964
- Issue date Aug 9, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumping process
- Patent number 6,908,842
- Issue date Jun 21, 2005
- Advanced Semiconductor Engineering, Inc.
- Jau-Shoung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-bump-metallurgy layer for improving adhesion
- Patent number 6,891,274
- Issue date May 10, 2005
- Advanced Semiconductor Engineering, Inc.
- William Tze-You Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of modifying tin to lead ratio in tin-lead bump
- Patent number 6,877,653
- Issue date Apr 12, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump and fabricating process thereof
- Patent number 6,864,168
- Issue date Mar 8, 2005
- Advanced Semiconductor Engineering, Inc.
- William Tze-You Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating wafer bumps
- Patent number 6,846,719
- Issue date Jan 25, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Water-level package with bump ring
- Patent number 6,838,762
- Issue date Jan 4, 2005
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with a cavity and fabricating method thereof
- Patent number 6,822,324
- Issue date Nov 23, 2004
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-ball-metallurgy layer
- Patent number 6,819,002
- Issue date Nov 16, 2004
- Advanced Semiconductor Engineering, Inc.
- William Tze-You Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microsystem package structure
- Patent number 6,809,852
- Issue date Oct 26, 2004
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP PACKAGE STRUCTURE
- Publication number 20070290318
- Publication date Dec 20, 2007
- Advanced Semiconductor Engineering, Inc.
- Su TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20070267758
- Publication date Nov 22, 2007
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Su TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package and method for manufacturing the same
- Publication number 20070087478
- Publication date Apr 19, 2007
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE METHOD
- Publication number 20070087480
- Publication date Apr 19, 2007
- Advanced Semiconductor Engineering, Inc.
- Su TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method for manufacturing the same
- Publication number 20060183313
- Publication date Aug 17, 2006
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip package structure
- Publication number 20060138631
- Publication date Jun 29, 2006
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip package structure
- Publication number 20060131717
- Publication date Jun 22, 2006
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip package structure
- Publication number 20060131718
- Publication date Jun 22, 2006
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal enhance package and manufacturing method thereof
- Publication number 20060094161
- Publication date May 4, 2006
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer stacking package method
- Publication number 20060057776
- Publication date Mar 16, 2006
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip package structure
- Publication number 20060055019
- Publication date Mar 16, 2006
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quad flat non-leaded package
- Publication number 20060001136
- Publication date Jan 5, 2006
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip package, semiconductor package with bumps and method for...
- Publication number 20050233571
- Publication date Oct 20, 2005
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump and fabricating process thereof
- Publication number 20050200014
- Publication date Sep 15, 2005
- William Tze-You Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20050189641
- Publication date Sep 1, 2005
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE STRUCTURE
- Publication number 20050161812
- Publication date Jul 28, 2005
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip package structure
- Publication number 20050139979
- Publication date Jun 30, 2005
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip package structure
- Publication number 20050140022
- Publication date Jun 30, 2005
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless semiconductor package
- Publication number 20050073032
- Publication date Apr 7, 2005
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package structure and method for manufacturing the same
- Publication number 20050046046
- Publication date Mar 3, 2005
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromachine package and method for manufacturing the same
- Publication number 20050017334
- Publication date Jan 27, 2005
- Su Tao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor chip with bumps and method for manufacturing the same
- Publication number 20040251545
- Publication date Dec 16, 2004
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROSYSTEM PACKAGE STRUCTURE
- Publication number 20040184133
- Publication date Sep 23, 2004
- Tao Su
- G02 - OPTICS
Information Patent Application
Semiconductor chip package and method for manufacturing the same
- Publication number 20040175862
- Publication date Sep 9, 2004
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal enhance MCM package and manufacturing method thereof
- Publication number 20040150102
- Publication date Aug 5, 2004
- Advanced Semiconductor Engineering, Inc.
- Shih-Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bumping process
- Publication number 20040127009
- Publication date Jul 1, 2004
- Advanced Semiconductor Engineering, Inc.
- Jau-Shoung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal enhance package and manufacturing method thereof
- Publication number 20040125568
- Publication date Jul 1, 2004
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bumping process
- Publication number 20040127010
- Publication date Jul 1, 2004
- Advanced Semiconductor Engineering, Inc.
- Jau-Shoung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal enhance MCM package
- Publication number 20040124512
- Publication date Jul 1, 2004
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME]
- Publication number 20040124515
- Publication date Jul 1, 2004
- SU TAO
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor chip package

Wafer stacking package method

Semiconductor package and method for manufacturing the same

Multi-chip package structure

Multi-chip package structure

Process for sawing substrate strip

Semiconductor chip package

Quad flat non-leaded package

Multi-chip package structure

Leadless semiconductor package

Wafer-level package structure

Semiconductor package and method for manufacturing the same

Semiconductor package and manufacturing method thereof

Micromachine package and method for manufacturing the same

Thermal enhance MCM package and manufacturing method thereof

Optical component package and packaging including an optical compon...

Bump fabrication process

Wafer level package structure with a heat slug

Wafer bumping process with solder balls bonded to under bump metall...

Semiconductor package

Structure for preventing burnt fuse pad from further electrical con...

Bumping process

Under-bump-metallurgy layer for improving adhesion

Method of modifying tin to lead ratio in tin-lead bump

Bump and fabricating process thereof

Process for fabricating wafer bumps

Water-level package with bump ring

Wafer-level package with a cavity and fabricating method thereof

Under-ball-metallurgy layer

Microsystem package structure

Patents Applicationslast 30 patents

MULTI-CHIP PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

Semiconductor chip package and method for manufacturing the same

CHIP PACKAGE METHOD

Semiconductor package and method for manufacturing the same

Multi-chip package structure

Multi-chip package structure

Multi-chip package structure

Thermal enhance package and manufacturing method thereof

Wafer stacking package method

Multi-chip package structure

Quad flat non-leaded package

Flip chip package, semiconductor package with bumps and method for...

Bump and fabricating process thereof

Semiconductor package

WAFER-LEVEL PACKAGE STRUCTURE

Multi-chip package structure

Multi-chip package structure

Leadless semiconductor package

Semiconductor package structure and method for manufacturing the same

Micromachine package and method for manufacturing the same

Semiconductor chip with bumps and method for manufacturing the same

MICROSYSTEM PACKAGE STRUCTURE

Semiconductor chip package and method for manufacturing the same

Thermal enhance MCM package and manufacturing method thereof

Bumping process

Thermal enhance package and manufacturing method thereof

Bumping process

Thermal enhance MCM package

[CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME]