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Tao-Yu Chen

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  • Kaohsiung, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Process for sawing substrate strip
    • Patent number 7,168,352
    • Issue date Jan 30, 2007
    • Advanced Semiconductor Engineering, Inc.
    • Jau-Yuen Su
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Molding method for BGA semiconductor chip package
    • Patent number 6,338,813
    • Issue date Jan 15, 2002
    • Advanced Semiconductor Engineering, Inc.
    • Kao-Yu Hsu
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Structure of a solder mask for the circuit module of a BGA substrate
    • Patent number 6,316,828
    • Issue date Nov 13, 2001
    • Advanced Semiconductor Engineering, Inc.
    • Su Tao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Ball bonding method on a chip
    • Patent number 6,176,417
    • Issue date Jan 23, 2001
    • Advanced Semiconductor Engineering Inc.
    • Yu-Fang Tsai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor packaging device
    • Patent number 5,982,625
    • Issue date Nov 9, 1999
    • Advanced Semiconductor Engineering, Inc.
    • Kun-Ching Chen
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents