Taro Hirai

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Ohtsu-Shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate, multi-layered wiring substrate and method of fabr...
- Patent number 6,492,597
- Issue date Dec 10, 2002
- NEC Corporation
- Kenzo Fujii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of cathode member and electronic tube equipped t...
- Patent number 5,881,355
- Issue date Mar 9, 1999
- NEC Corporation
- Toshikazu Sugimura
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
Multiple wiring board
- Publication number 20030104184
- Publication date Jun 5, 2003
- NEC ELECTRONICS CORPORATION
- Taro Hirai
- B32 - LAYERED PRODUCTS
Information Patent Application
Wiring substrate for small electronic component and manufacturing m...
- Publication number 20030058629
- Publication date Mar 27, 2003
- Taro Hirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board having plating conductive layer with bumps an...
- Publication number 20030036220
- Publication date Feb 20, 2003
- Gorou Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible wiring substrate interposed between semiconductor element...
- Publication number 20030006489
- Publication date Jan 9, 2003
- Kenzo Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring substrate, multi-layered wiring substrate and method of fabr...
- Publication number 20010002625
- Publication date Jun 7, 2001
- NEC Corporation
- Kenzo Fujii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR