Taryn J. Davis

Person

Kissimmee, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and structure for flip-chip package reliability monitoring u...
- Patent number 10,553,503
- Issue date Feb 4, 2020
- International Business Machines Corporation
- Taryn J. Davis
- G01 - MEASURING TESTING
Information Patent Grant
Time temperature monitoring system
- Patent number 10,504,807
- Issue date Dec 10, 2019
- International Business Machines Corporation
- Taryn J. Davis
- G01 - MEASURING TESTING
Information Patent Grant
Time temperature monitoring system
- Patent number 10,217,682
- Issue date Feb 26, 2019
- International Business Machines Corporation
- Taryn J. Davis
- G01 - MEASURING TESTING
Information Patent Grant
Scanning acoustic microscope sensor array for chip-packaging intera...
- Patent number 10,134,649
- Issue date Nov 20, 2018
- International Business Machines Corporation
- Taryn J. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for flip-chip package reliability monitoring u...
- Patent number 10,068,812
- Issue date Sep 4, 2018
- International Business Machines Corporation
- Taryn J. Davis
- G01 - MEASURING TESTING
Information Patent Grant
Time temperature monitoring system
- Patent number 10,032,683
- Issue date Jul 24, 2018
- International Business Machines Corporation
- Taryn J. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scanning acoustic microscope sensor array for chip-packaging intera...
- Patent number 10,008,427
- Issue date Jun 26, 2018
- International Business Machines Corporation
- Taryn J. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polygon die packaging
- Patent number 9,911,716
- Issue date Mar 6, 2018
- International Business Machines Corporation
- Taryn J. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for flip-chip package reliability monitoring u...
- Patent number 9,818,655
- Issue date Nov 14, 2017
- International Business Machines Corporation
- Taryn J. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading layer with high thermal conductivity
- Patent number 9,437,515
- Issue date Sep 6, 2016
- International Business Machines Corporation
- Evan G. Colgan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal hot spot cooling for semiconductor devices
- Patent number 9,401,315
- Issue date Jul 26, 2016
- GLOBALFOUNDRIES Inc.
- Paul F. Bodenweber
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TIME TEMPERATURE MONITORING SYSTEM
- Publication number 20180350702
- Publication date Dec 6, 2018
- International Business Machines Corporation
- Taryn J. Davis
- G01 - MEASURING TESTING
Information Patent Application
TIME TEMPERATURE MONITORING SYSTEM
- Publication number 20180226308
- Publication date Aug 9, 2018
- International Business Machines Corporation
- Taryn J. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR FLIP-CHIP PACKAGE RELIABILITY MONITORING U...
- Publication number 20180047644
- Publication date Feb 15, 2018
- International Business Machines Corporation
- Taryn J. Davis
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND STRUCTURE FOR FLIP-CHIP PACKAGE RELIABILITY MONITORING U...
- Publication number 20180019172
- Publication date Jan 18, 2018
- International Business Machines Corporation
- Taryn J. Davis
- G01 - MEASURING TESTING
Information Patent Application
SCANNING ACOUSTIC MICROSCOPE SENSOR ARRAY FOR CHIP-PACKAGING INTERA...
- Publication number 20170271219
- Publication date Sep 21, 2017
- International Business Machines Corporation
- Taryn J. Davis
- G01 - MEASURING TESTING
Information Patent Application
SCANNING ACOUSTIC MICROSCOPE SENSOR ARRAY FOR CHIP-PACKAGING INTERA...
- Publication number 20170194221
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Taryn J. Davis
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND STRUCTURE FOR FLIP-CHIP PACKAGE RELIABILITY MONITORING U...
- Publication number 20170162455
- Publication date Jun 8, 2017
- International Business Machines Corporation
- Taryn J. Davis
- G01 - MEASURING TESTING
Information Patent Application
TIME TEMPERATURE MONITORING SYSTEM
- Publication number 20160372391
- Publication date Dec 22, 2016
- International Business Machines Corporation
- Taryn J. Davis
- G01 - MEASURING TESTING
Information Patent Application
POLYGON DIE PACKAGING
- Publication number 20160225742
- Publication date Aug 4, 2016
- International Business Machines Corporation
- Taryn J. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY
- Publication number 20150373879
- Publication date Dec 24, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY
- Publication number 20150371922
- Publication date Dec 24, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY
- Publication number 20150371917
- Publication date Dec 24, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY
- Publication number 20150371918
- Publication date Dec 24, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY
- Publication number 20150371919
- Publication date Dec 24, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY
- Publication number 20150373880
- Publication date Dec 24, 2015
- International Business Machines Corporation
- Evan G. Colgan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY
- Publication number 20140284040
- Publication date Sep 25, 2014
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS

Taryn J. Davis

Person

Patents Grantslast 30 patents

Method and structure for flip-chip package reliability monitoring u...

Time temperature monitoring system

Time temperature monitoring system

Scanning acoustic microscope sensor array for chip-packaging intera...

Method and structure for flip-chip package reliability monitoring u...

Time temperature monitoring system

Scanning acoustic microscope sensor array for chip-packaging intera...

Polygon die packaging

Method and structure for flip-chip package reliability monitoring u...

Heat spreading layer with high thermal conductivity

Thermal hot spot cooling for semiconductor devices

Patents Applicationslast 30 patents

TIME TEMPERATURE MONITORING SYSTEM

TIME TEMPERATURE MONITORING SYSTEM

METHOD AND STRUCTURE FOR FLIP-CHIP PACKAGE RELIABILITY MONITORING U...

METHOD AND STRUCTURE FOR FLIP-CHIP PACKAGE RELIABILITY MONITORING U...

SCANNING ACOUSTIC MICROSCOPE SENSOR ARRAY FOR CHIP-PACKAGING INTERA...

SCANNING ACOUSTIC MICROSCOPE SENSOR ARRAY FOR CHIP-PACKAGING INTERA...

METHOD AND STRUCTURE FOR FLIP-CHIP PACKAGE RELIABILITY MONITORING U...

TIME TEMPERATURE MONITORING SYSTEM

POLYGON DIE PACKAGING

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY

HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY