Tasha E. Lopez

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Santa Ana, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Compressible films surrounding solder connectors
- Patent number 7,566,649
- Issue date Jul 28, 2009
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low stress conductive polymer bump
- Patent number 7,442,878
- Issue date Oct 28, 2008
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compressible films surrounding solder connectors
- Patent number 7,332,821
- Issue date Feb 19, 2008
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low stress conductive polymer bump
- Patent number 7,170,187
- Issue date Jan 30, 2007
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS
- Publication number 20080009101
- Publication date Jan 10, 2008
- William E. Bernier
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LOW STRESS CONDUCTIVE POLYMER BUMP
- Publication number 20070084629
- Publication date Apr 19, 2007
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW STRESS CONDUCTIVE POLYMER BUMP
- Publication number 20060043608
- Publication date Mar 2, 2006
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPRESSIBLE FILMS SURROUNDING SOLDER CONNECTORS
- Publication number 20060040567
- Publication date Feb 23, 2006
- International Business Machines Corporation
- William E. Bernier
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...