Tasi-Jung Wu

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect structure and method of forming same
- Patent number 11,728,296
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 10,811,374
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 10,157,866
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method
- Patent number 9,953,920
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation
- Patent number 9,748,190
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 9,679,859
- Issue date Jun 13, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 9,252,110
- Issue date Feb 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method
- Patent number 9,006,101
- Issue date Apr 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation
- Patent number 8,951,838
- Issue date Feb 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20210050316
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20180145046
- Publication date May 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20170271287
- Publication date Sep 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20160118356
- Publication date Apr 28, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method
- Publication number 20150235940
- Publication date Aug 20, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20150206846
- Publication date Jul 23, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Cost and Ultra-Thin Chip on Wafer on Substrate (CoWoS) Formation
- Publication number 20150130058
- Publication date May 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Cost and Ultra-Thin Chip on Wafer on Substrate (CoWoS) Formation
- Publication number 20140264834
- Publication date Sep 18, 2014
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method
- Publication number 20140061924
- Publication date Mar 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Tasi-Jung Wu

Person

Patents Grantslast 30 patents

Interconnect structure and method of forming same

Interconnect structure and method of forming same

Interconnect structure and method of forming same

Interconnect structure and method

Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation

Interconnect structure and method of forming same

Interconnect structure and method of forming same

Interconnect structure and method

Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation

Patents Applicationslast 30 patents

Interconnect Structure and Method of Forming Same

Interconnect Structure and Method of Forming Same

Interconnect Structure and Method of Forming Same

Interconnect Structure and Method of Forming Same

Interconnect Structure and Method

Interconnect Structure and Method of Forming Same

Low Cost and Ultra-Thin Chip on Wafer on Substrate (CoWoS) Formation

Low Cost and Ultra-Thin Chip on Wafer on Substrate (CoWoS) Formation

Interconnect Structure and Method