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Tasuku Koyanagi

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  • Ota-Ku, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Lift-off method for transferring optical device layer
    • Patent number 11,600,527
    • Issue date Mar 7, 2023
    • Disco Corporation
    • Tasuku Koyanagi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Lift-off method and laser processing apparatus
    • Patent number 11,552,214
    • Issue date Jan 10, 2023
    • Disco Corporation
    • Tasuku Koyanagi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Comparing method and laser processing apparatus
    • Patent number 11,211,296
    • Issue date Dec 28, 2021
    • Disco Corporation
    • Fumiya Kawano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Optical device layer transferring method
    • Patent number 11,011,670
    • Issue date May 18, 2021
    • Disco Corporation
    • Tasuku Koyanagi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Optical device wafer processing method
    • Patent number 10,916,679
    • Issue date Feb 9, 2021
    • Disco Corporation
    • Tasuku Koyanagi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of processing wafer
    • Patent number 10,886,159
    • Issue date Jan 5, 2021
    • Disco Corporation
    • Hiroshi Morikazu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Lift-off method
    • Patent number 10,854,774
    • Issue date Dec 1, 2020
    • Disco Corporation
    • Tasuku Koyanagi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Device transferring method
    • Patent number 10,658,220
    • Issue date May 19, 2020
    • Disco Corporation
    • Tasuku Koyanagi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lift-off method
    • Patent number 9,793,166
    • Issue date Oct 17, 2017
    • Disco Corporation
    • Tasuku Koyanagi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lift-off method
    • Patent number 9,530,929
    • Issue date Dec 27, 2016
    • Disco Corporation
    • Hiroshi Morikazu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Lift-off method
    • Patent number 9,531,154
    • Issue date Dec 27, 2016
    • Disco Corporation
    • Tasuku Koyanagi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Separation apparatus
    • Patent number 9,511,579
    • Issue date Dec 6, 2016
    • Disco Corporation
    • Hiroshi Morikazu
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Optical device wafer processing method
    • Patent number 8,178,425
    • Issue date May 15, 2012
    • Disco Corporation
    • Tasuku Koyanagi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Optical device wafer processing method
    • Patent number 8,148,184
    • Issue date Apr 3, 2012
    • Disco Corporation
    • Tasuku Koyanagi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20240128086
    • Publication date Apr 18, 2024
    • Disco Corporation
    • Hiroshi MORIKAZU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LIFT-OFF METHOD
    • Publication number 20240038591
    • Publication date Feb 1, 2024
    • Disco Corporation
    • Masato TERAJIMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20230191539
    • Publication date Jun 22, 2023
    • Disco Corporation
    • Atsushi MAEDA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LIFT-OFF METHOD AND LASER PROCESSING APPARATUS
    • Publication number 20210399163
    • Publication date Dec 23, 2021
    • Disco Corporation
    • Tasuku KOYANAGI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COMPARING METHOD AND LASER PROCESSING APPARATUS
    • Publication number 20210028071
    • Publication date Jan 28, 2021
    • Disco Corporation
    • Fumiya KAWANO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTICAL DEVICE LAYER TRANSFERRING METHOD
    • Publication number 20200343405
    • Publication date Oct 29, 2020
    • Disco Corporation
    • Tasuku Koyanagi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LIFT-OFF METHOD FOR TRANSFERRING OPTICAL DEVICE LAYER
    • Publication number 20200150341
    • Publication date May 14, 2020
    • Disco Corporation
    • Tasuku KOYANAGI
    • G02 - OPTICS
  • Information Patent Application

    METHOD FOR FORMING ADHEREND WITH OPTICAL THIN FILM
    • Publication number 20200095670
    • Publication date Mar 26, 2020
    • Disco Corporation
    • Tasuku KOYANAGI
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    OPTICAL DEVICE WAFER PROCESSING METHOD
    • Publication number 20200075796
    • Publication date Mar 5, 2020
    • Disco Corporation
    • Tasuku Koyanagi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DEVICE TRANSFERRING METHOD
    • Publication number 20190273009
    • Publication date Sep 5, 2019
    • Disco Corporation
    • Tasuku KOYANAGI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LIFT-OFF METHOD
    • Publication number 20190115494
    • Publication date Apr 18, 2019
    • Disco Corporation
    • Tasuku KOYANAGI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20180366362
    • Publication date Dec 20, 2018
    • Disco Corporation
    • Hiroshi Morikazu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LIFT-OFF METHOD
    • Publication number 20160013613
    • Publication date Jan 14, 2016
    • Disco Corporation
    • Tasuku Koyanagi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LIFT-OFF METHOD
    • Publication number 20150328872
    • Publication date Nov 19, 2015
    • Disco Corporation
    • Tasuku Koyanagi
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    LIFT-OFF METHOD
    • Publication number 20150221818
    • Publication date Aug 6, 2015
    • Disco Corporation
    • Hiroshi Morikazu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEPARATION APPARATUS
    • Publication number 20150202857
    • Publication date Jul 23, 2015
    • Disco Corporation
    • Hiroshi Morikazu
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    OPTICAL DEVICE WAFER PROCESSING METHOD
    • Publication number 20110195536
    • Publication date Aug 11, 2011
    • Disco Corporation
    • Tasuku Koyanagi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    OPTICAL DEVICE WAFER PROCESSING METHOD
    • Publication number 20110195537
    • Publication date Aug 11, 2011
    • Disco Corporation
    • Tasuku Koyanagi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    OPTICAL DEVICE WAFER PROCESSING METHOD
    • Publication number 20110195535
    • Publication date Aug 11, 2011
    • Disco Corporation
    • Tasuku Koyanagi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER DIVIDING METHOD USING CO2 LASER
    • Publication number 20110186554
    • Publication date Aug 4, 2011
    • Disco Corporation
    • Tasuku Koyanagi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR