Tatsuhiko Akiyama

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 8,652,880
- Issue date Feb 18, 2014
- Renesas Electronics Corporation
- Koji Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing magnetic memory chip device
- Patent number 8,524,510
- Issue date Sep 3, 2013
- Renesas Electronics Corporation
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 8,258,604
- Issue date Sep 4, 2012
- Renesas Electronics Corporation
- Koji Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing magnetic memory chip device
- Patent number 8,124,425
- Issue date Feb 28, 2012
- Renesas Electronics Corporation
- Kazuyuki Misumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of producing the same
- Patent number 6,583,511
- Issue date Jun 24, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip package semiconductor device
- Patent number 6,545,366
- Issue date Apr 8, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including thermal neutron absorption material
- Patent number 6,255,719
- Issue date Jul 3, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Hirotada Kuriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealed semiconductor device
- Patent number 5,659,199
- Issue date Aug 19, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Ryuichiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealed semiconductor device
- Patent number 4,942,454
- Issue date Jul 17, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Ryuichiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device
- Patent number 4,884,124
- Issue date Nov 28, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Ryuichiro Mori
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20120309131
- Publication date Dec 6, 2012
- Renesas Electronics Corporation
- KOJI BANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MAGNETIC MEMORY CHIP DEVICE
- Publication number 20120122246
- Publication date May 17, 2012
- RENESAS ELECTRONICS CORPORATION
- Kazuyuki MISUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20100164077
- Publication date Jul 1, 2010
- RENESAS TECHNOLOGY CORP.
- Koji Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SEMICONDUCTOR DEVICE
- Publication number 20020173076
- Publication date Nov 21, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020089050
- Publication date Jul 11, 2002
- Kazunari Michii
- H01 - BASIC ELECTRIC ELEMENTS

Tatsuhiko Akiyama

Person

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing same

Method for manufacturing magnetic memory chip device

Semiconductor device and method of manufacturing same

Method for manufacturing magnetic memory chip device

Semiconductor device and a method of producing the same

Multiple chip package semiconductor device

Semiconductor device including thermal neutron absorption material

Resin sealed semiconductor device

Resin sealed semiconductor device

Resin-encapsulated semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

METHOD FOR MANUFACTURING MAGNETIC MEMORY CHIP DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

A SEMICONDUCTOR DEVICE

Semiconductor device