Tatsumi Kusaba

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing a bonded wafer
- Patent number 8,003,494
- Issue date Aug 23, 2011
- SUMCO Corporation
- Hideki Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
P-type silicon wafer and method for heat-treating the same
- Patent number 7,939,441
- Issue date May 10, 2011
- Sumco Corporation
- Tatsumi Kusaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded silicon wafer
- Patent number 7,927,957
- Issue date Apr 19, 2011
- SUMCO Corporation
- Tatsumi Kusaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded wafer
- Patent number 7,927,972
- Issue date Apr 19, 2011
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing bonded wafer
- Patent number 7,767,549
- Issue date Aug 3, 2010
- Sumco Corporation
- Hidehiko Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for regenerating layer transferred wafer
- Patent number 7,763,541
- Issue date Jul 27, 2010
- Sumco Corporation
- Hidehiko Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded wafer
- Patent number 7,745,306
- Issue date Jun 29, 2010
- Sumco Corporation
- Hidehiko Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded wafer
- Patent number 7,718,509
- Issue date May 18, 2010
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High purification method of jig for semiconductor heat treatment
- Patent number 7,601,227
- Issue date Oct 13, 2009
- Sumco Corporation
- Tatsumi Kusaba
- C30 - CRYSTAL GROWTH
Information Patent Grant
P-type silicon wafer and method for heat-treating the same
- Patent number 7,541,663
- Issue date Jun 2, 2009
- Sumco Corporation
- Tatsumi Kusaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for cleaning silicon substrate
- Patent number 7,534,728
- Issue date May 19, 2009
- Sumco Corporation
- Hideki Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded substrate and bonded substrate manu...
- Patent number 7,442,623
- Issue date Oct 28, 2008
- Sumco Corporation
- Akihiko Endo
- B08 - CLEANING
Information Patent Grant
Method for manufacturing SOI substrate
- Patent number 7,416,960
- Issue date Aug 26, 2008
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI substrate
- Patent number 7,364,984
- Issue date Apr 29, 2008
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI substrate
- Patent number 7,354,844
- Issue date Apr 8, 2008
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for heat-treating silicon wafer and silicon wafer
- Patent number 7,311,775
- Issue date Dec 25, 2007
- Sumco Corporation
- Tatsumi Kusaba
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING A BONDED WAFER
- Publication number 20100248447
- Publication date Sep 30, 2010
- SUMCO CORPORATION
- Hideki Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Bonded Wafer
- Publication number 20100184270
- Publication date Jul 22, 2010
- SUMCO CORPORATION
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING BONDED WAFER
- Publication number 20100144119
- Publication date Jun 10, 2010
- SUMCO CORPORATION
- Tatsumi Kusaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING BONDED SILICON WAFER
- Publication number 20100068867
- Publication date Mar 18, 2010
- SUMCO CORPORATION
- Tatsumi Kusaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Producing Bonded Wafer
- Publication number 20090298261
- Publication date Dec 3, 2009
- SUMCO CORPORATION
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing bonded wafer
- Publication number 20090258475
- Publication date Oct 15, 2009
- SUMCO CORPORATION
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
P-TYPE SILICON WAFER AND METHOD FOR HEAT-TREATING THE SAME
- Publication number 20090233420
- Publication date Sep 17, 2009
- SUMCO CORPORATION
- Tatsumi Kusaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing bonded wafer
- Publication number 20080213974
- Publication date Sep 4, 2008
- SUMCO CORPORATION
- Hidehiko OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Regenerating Layer Transferred Wafer and Layer Transfer...
- Publication number 20080124929
- Publication date May 29, 2008
- Hidehiko Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing bonded wafer
- Publication number 20080020514
- Publication date Jan 24, 2008
- SUMCO CORPORATION
- Hidehiko Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing SOI Substrate
- Publication number 20080014716
- Publication date Jan 17, 2008
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing SOI Substrate
- Publication number 20080014717
- Publication date Jan 17, 2008
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Bonded Substrate and Bonded Substrate Manu...
- Publication number 20070117281
- Publication date May 24, 2007
- Akihiko Endo
- B08 - CLEANING
Information Patent Application
High purification method of jig for semiconductor heat treatment
- Publication number 20070028945
- Publication date Feb 8, 2007
- SUMCO CORPORATION
- Tatsumi Kusaba
- C30 - CRYSTAL GROWTH
Information Patent Application
Process for cleaning silicon substrate
- Publication number 20060234461
- Publication date Oct 19, 2006
- SUMCO CORPORATION
- Hideki Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing SOI substrate
- Publication number 20060177993
- Publication date Aug 10, 2006
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for heat-treating silicon wafer and silicon wafer
- Publication number 20060027161
- Publication date Feb 9, 2006
- SUMCO CORPORATION
- Tatsumi Kusaba
- C30 - CRYSTAL GROWTH
Information Patent Application
P-type silicon wafer and method for heat-treating the same
- Publication number 20060027897
- Publication date Feb 9, 2006
- SUMCO CORPORATION
- Tatsumi Kusaba
- H01 - BASIC ELECTRIC ELEMENTS

Tatsumi Kusaba

Person

Patents Grantslast 30 patents

Method for producing a bonded wafer

P-type silicon wafer and method for heat-treating the same

Method for producing bonded silicon wafer

Method for producing bonded wafer

Method of manufacturing bonded wafer

Process for regenerating layer transferred wafer

Method for producing bonded wafer

Method for producing bonded wafer

High purification method of jig for semiconductor heat treatment

P-type silicon wafer and method for heat-treating the same

Process for cleaning silicon substrate

Method for manufacturing bonded substrate and bonded substrate manu...

Method for manufacturing SOI substrate

Method for manufacturing SOI substrate

Method for manufacturing SOI substrate

Method for heat-treating silicon wafer and silicon wafer

Patents Applicationslast 30 patents

METHOD FOR PRODUCING A BONDED WAFER

Method for Producing Bonded Wafer

METHOD OF PRODUCING BONDED WAFER

METHOD FOR PRODUCING BONDED SILICON WAFER

Method For Producing Bonded Wafer

Method for producing bonded wafer

P-TYPE SILICON WAFER AND METHOD FOR HEAT-TREATING THE SAME

Method of manufacturing bonded wafer

Process for Regenerating Layer Transferred Wafer and Layer Transfer...

Method for producing bonded wafer

Method for Manufacturing SOI Substrate

Method for Manufacturing SOI Substrate

Method for Manufacturing Bonded Substrate and Bonded Substrate Manu...

High purification method of jig for semiconductor heat treatment

Process for cleaning silicon substrate

Method for manufacturing SOI substrate

Method for heat-treating silicon wafer and silicon wafer

P-type silicon wafer and method for heat-treating the same