Tatsumi Tsuchiya

Person

Ayase, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Flexure and actuator system for magnetic recording device
- Patent number 10,468,057
- Issue date Nov 5, 2019
- Western Digital Technologies, Inc.
- Irizo Naniwa
- G11 - INFORMATION STORAGE
Information Patent Grant
Solder ball jet nozzle having improved reliability
- Patent number 10,029,327
- Issue date Jul 24, 2018
- Western Digital Technologies, Inc.
- Kenichi Murata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Suspension standoff geometry for slider crown change reduction
- Patent number 9,558,768
- Issue date Jan 31, 2017
- HGST Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatus for interconnecting connection pads of a head-gimbal asse...
- Patent number 8,881,967
- Issue date Nov 11, 2014
- HGST Netherlands B.V.
- Yuhsuke Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical contact for an energy-assisted magnetic recording laser...
- Patent number 8,837,261
- Issue date Sep 16, 2014
- HGST Netherlands B.V.
- Kenichi Murata
- G11 - INFORMATION STORAGE
Information Patent Grant
Head gimbal assembly and disk drive with a piezoelectric element
- Patent number 8,593,765
- Issue date Nov 26, 2013
- HGST Netherlands B.V.
- Yoshio Uematsu
- G11 - INFORMATION STORAGE
Information Patent Grant
Head-gimbal assembly with a suspension-lead pad having a form that...
- Patent number 8,477,457
- Issue date Jul 2, 2013
- HGST Netherlands, B.V.
- Yuhsuke Matsumoto
- G11 - INFORMATION STORAGE
Information Patent Grant
Head-gimbal assembly, microactuator, and manufacturing method of th...
- Patent number 8,427,783
- Issue date Apr 23, 2013
- HGST Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Method and apparatus for manufacturing a head-gimbal assembly
- Patent number 8,245,749
- Issue date Aug 21, 2012
- Hitachi Global Storage Technologies, Netherlands B.V.
- Hideto Imai
- G11 - INFORMATION STORAGE
Information Patent Grant
Approaches for manufacturing a head gimbal assembly
- Patent number 7,984,545
- Issue date Jul 26, 2011
- Hitachi Global Storage Technologies Netherlands B.V.
- Yuhsuke Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally insulating bonding pad structure for solder reflow connec...
- Patent number 7,893,534
- Issue date Feb 22, 2011
- Hitachi Global Storage Technologies, Netherlands, B.V.
- Toshiki Hirano
- G11 - INFORMATION STORAGE
Information Patent Grant
Magnetic head assembly that facilitates recovery of a magnetic head...
- Patent number 7,859,793
- Issue date Dec 28, 2010
- Hitachi Global Storage Technologies Netherlands B.V.
- Yoshio Uematsu
- G11 - INFORMATION STORAGE
Information Patent Grant
Rotating disk storage device and integrated wire head suspension as...
- Patent number 7,583,475
- Issue date Sep 1, 2009
- Hitachi Global Storage Technologies Netherlands B.V.
- Yuhsuke Matsumoto
- G11 - INFORMATION STORAGE
Information Patent Grant
Thin film magnetic head and head gimbal assembly
- Patent number 7,554,769
- Issue date Jun 30, 2009
- Hitachi Global Storage Technologies Netherlands B.V.
- Hideo Yamakura
- G11 - INFORMATION STORAGE
Information Patent Grant
Head gimbal assembly method with solder fillet formed by laser irra...
- Patent number 7,486,480
- Issue date Feb 3, 2009
- Hitachi Global Storage Technolgies Netherlands B.V.
- Takuya Satoh
- G11 - INFORMATION STORAGE
Information Patent Grant
Head/slider supporting structure having lead wire inclined relative...
- Patent number 7,417,827
- Issue date Aug 26, 2008
- Hitachi Global Storage Technologies Netherlands B.V.
- Hiroyasu Tsuchida
- G11 - INFORMATION STORAGE
Information Patent Grant
Head gimbal assembly and magnetic disk drive with specific solder b...
- Patent number 7,400,470
- Issue date Jul 15, 2008
- Hitachi Global Storage Technologies Netherlands B.V.
- Yuhsuke Matsumoto
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of assembling a head gimbal assembly
- Patent number 7,380,329
- Issue date Jun 3, 2008
- Hitachi Global Storage Technologies Netherlands B.V.
- Takao Kidachi
- G11 - INFORMATION STORAGE
Information Patent Grant
Transfer system for assembling a head gimbal assembly
- Patent number 7,210,221
- Issue date May 1, 2007
- Hitachi Global Storage Technologies Netherlands B.V.
- Takao Kidachi
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of constructing an integrated lead suspension
- Patent number 7,168,154
- Issue date Jan 30, 2007
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Base plate structure, transfer system, and method and apparatus for...
- Patent number 7,161,766
- Issue date Jan 9, 2007
- Hitachi Global Storage Technologies Netherlands B.V.
- Takao Kidachi
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of constructing an integrated lead suspension
- Patent number 7,137,188
- Issue date Nov 21, 2006
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of constructing an integrated lead suspension
- Patent number 7,137,189
- Issue date Nov 21, 2006
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated lead suspension and method of construction
- Patent number 6,989,969
- Issue date Jan 24, 2006
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated lead suspension and method of construction
- Patent number 6,985,335
- Issue date Jan 10, 2006
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated lead suspension and method of construction
- Patent number 6,879,465
- Issue date Apr 12, 2005
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of constructing an integrated lead suspension
- Patent number 6,871,392
- Issue date Mar 29, 2005
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatus and method for separating head gimbal assembly from bondi...
- Patent number 6,848,167
- Issue date Feb 1, 2005
- International Business Machines Corporation
- Yasuhiro Mita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for assembling a head gimbal assembly
- Patent number 6,823,581
- Issue date Nov 30, 2004
- Hitachi Global Storage Technologies Netherlands B.V.
- Takao Kidachi
- G11 - INFORMATION STORAGE
Information Patent Grant
Solder ball disposing apparatus, solder ball reflow apparatus, and...
- Patent number 6,742,694
- Issue date Jun 1, 2004
- Hitachi Global Storage Technologies Netherlands B.V.
- Takuya Satoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLEXURE AND ACTUATOR SYSTEM FOR MAGNETIC RECORDING DEVICE
- Publication number 20190267032
- Publication date Aug 29, 2019
- WESTERN DIGITAL TECHNOLOGIES, INC.
- Irizo Naniwa
- G11 - INFORMATION STORAGE
Information Patent Application
Solder Ball Jet Nozzle Having Improved Reliability
- Publication number 20160121416
- Publication date May 5, 2016
- HGST NETHERLANDS B.V.
- Kenichi Murata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER-JET NOZZLE, LASER-SOLDERING TOOL, AND METHOD, FOR LASERSOLDE...
- Publication number 20130256281
- Publication date Oct 3, 2013
- Tatsumi Tsuchiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAD-GIMBAL ASSEMBLY WITH A SUSPENSION-LEAD PAD HAVING A FORM THAT...
- Publication number 20130063839
- Publication date Mar 14, 2013
- Yuhsuke Matsumoto
- G11 - INFORMATION STORAGE
Information Patent Application
HEAD GIMBAL ASSEMBLY AND DISK DRIVE WITH A PIEZOELECTRIC ELEMENT
- Publication number 20110149440
- Publication date Jun 23, 2011
- Yoshio Uematsu
- G11 - INFORMATION STORAGE
Information Patent Application
CONNECTING ELECTRICAL PARTS
- Publication number 20110132879
- Publication date Jun 9, 2011
- Yuhsuke Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAD-GIMBAL ASSEMBLY, MICROACTUATOR, AND MANUFACTURING METHOD OF TH...
- Publication number 20110075301
- Publication date Mar 31, 2011
- Tatsumi TSUCHIYA
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING A HEAD-GIMBAL ASSEMBLY
- Publication number 20100154989
- Publication date Jun 24, 2010
- Hideto IMAI
- G11 - INFORMATION STORAGE
Information Patent Application
APPARATUS FOR INTERCONNECTING CONNECTION PADS OF A HEAD-GIMBAL ASSE...
- Publication number 20100089981
- Publication date Apr 15, 2010
- Yohsuke Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermally insulating bonding pad structure for solder reflow connec...
- Publication number 20090039505
- Publication date Feb 12, 2009
- Toshiki Hirano
- G11 - INFORMATION STORAGE
Information Patent Application
Method and apparatus for manufacturing a head gimbal assembly
- Publication number 20090025205
- Publication date Jan 29, 2009
- Yuhsuke Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for a microactuator bonding pad structure for...
- Publication number 20080180856
- Publication date Jul 31, 2008
- Toshiki Hirano
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Magnetic head assembly and magnetic disk drive
- Publication number 20070263323
- Publication date Nov 15, 2007
- Hitachi Global Storage Technologies Netherlands B.V.
- Yoshio Uematsu
- G11 - INFORMATION STORAGE
Information Patent Application
Head gimbal assembly and magnetic disk drive with solder ball conne...
- Publication number 20060238921
- Publication date Oct 26, 2006
- Hitachi Global Storage Technologies Netherlands B.V.
- Yuhsuke Matsumoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Manufacturing method of head gimbal assembly with solder fillet and...
- Publication number 20060193084
- Publication date Aug 31, 2006
- Hitachi Global Storage Technologies Netherlands B.V.
- Takuya Satoh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Thin film magnetic head and head gimbal assembly
- Publication number 20050219753
- Publication date Oct 6, 2005
- Hitachi Global Storage Technologies Netherlands B.V.
- Hideo Yamakura
- G11 - INFORMATION STORAGE
Information Patent Application
Rotating disk storage device and integrated wire head suspension as...
- Publication number 20050199680
- Publication date Sep 15, 2005
- Hitachi Global Storage Technologies Netherlands, B.V.
- Yuhsuke Matsumoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Head/slider supporting structure and rotating disk storage device
- Publication number 20050195529
- Publication date Sep 8, 2005
- Hitachi Global Storage Technologies Netherlands, B.V.
- Hiroyasu Tsuchida
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated lead suspension and method of construction
- Publication number 20050078415
- Publication date Apr 14, 2005
- Tatsumi Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated lead suspension and method of construction
- Publication number 20050063096
- Publication date Mar 24, 2005
- Tatsumi Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated lead suspension and method of construction
- Publication number 20050047020
- Publication date Mar 3, 2005
- Tatsumi Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated lead suspension and method of construction
- Publication number 20050047022
- Publication date Mar 3, 2005
- Tatsumi Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated lead suspension and method of construction
- Publication number 20050047009
- Publication date Mar 3, 2005
- Tatsumi Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Base plate structure, transfer system, and method and apparatus for...
- Publication number 20050028353
- Publication date Feb 10, 2005
- Takao Kidachi
- G11 - INFORMATION STORAGE
Information Patent Application
Base plate structure, transfer system, and method and apparatus for...
- Publication number 20050024777
- Publication date Feb 3, 2005
- Takao Kidachi
- G11 - INFORMATION STORAGE
Information Patent Application
Base plate structure, transfer system, and method and apparatus for...
- Publication number 20050022372
- Publication date Feb 3, 2005
- Takao Kidachi
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated lead suspension and method of construction
- Publication number 20030188887
- Publication date Oct 9, 2003
- Tatsumi Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated lead suspension and method of construction
- Publication number 20030070834
- Publication date Apr 17, 2003
- International Business Machines Corporation
- Tatsumi Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solder-ball bonding device and method
- Publication number 20020179696
- Publication date Dec 5, 2002
- International Business Machines Corporation
- Surya Pattanaik
- G11 - INFORMATION STORAGE
Information Patent Application
Solder ball disposing apparatus, solder ball reflow apparatus, and...
- Publication number 20020113115
- Publication date Aug 22, 2002
- International Business Machines Corporation
- Takuya Satoh
- G11 - INFORMATION STORAGE

Tatsumi Tsuchiya

Person

Patents Grantslast 30 patents

Flexure and actuator system for magnetic recording device

Solder ball jet nozzle having improved reliability

Suspension standoff geometry for slider crown change reduction

Apparatus for interconnecting connection pads of a head-gimbal asse...

Electrical contact for an energy-assisted magnetic recording laser...

Head gimbal assembly and disk drive with a piezoelectric element

Head-gimbal assembly with a suspension-lead pad having a form that...

Head-gimbal assembly, microactuator, and manufacturing method of th...

Method and apparatus for manufacturing a head-gimbal assembly

Approaches for manufacturing a head gimbal assembly

Thermally insulating bonding pad structure for solder reflow connec...

Magnetic head assembly that facilitates recovery of a magnetic head...

Rotating disk storage device and integrated wire head suspension as...

Thin film magnetic head and head gimbal assembly

Head gimbal assembly method with solder fillet formed by laser irra...

Head/slider supporting structure having lead wire inclined relative...

Head gimbal assembly and magnetic disk drive with specific solder b...

Method of assembling a head gimbal assembly

Transfer system for assembling a head gimbal assembly

Method of constructing an integrated lead suspension

Base plate structure, transfer system, and method and apparatus for...

Method of constructing an integrated lead suspension

Method of constructing an integrated lead suspension

Integrated lead suspension and method of construction

Integrated lead suspension and method of construction

Integrated lead suspension and method of construction

Method of constructing an integrated lead suspension

Apparatus and method for separating head gimbal assembly from bondi...

Apparatus for assembling a head gimbal assembly

Solder ball disposing apparatus, solder ball reflow apparatus, and...

Patents Applicationslast 30 patents

FLEXURE AND ACTUATOR SYSTEM FOR MAGNETIC RECORDING DEVICE

Solder Ball Jet Nozzle Having Improved Reliability

SOLDER-JET NOZZLE, LASER-SOLDERING TOOL, AND METHOD, FOR LASERSOLDE...

HEAD-GIMBAL ASSEMBLY WITH A SUSPENSION-LEAD PAD HAVING A FORM THAT...

HEAD GIMBAL ASSEMBLY AND DISK DRIVE WITH A PIEZOELECTRIC ELEMENT

CONNECTING ELECTRICAL PARTS

HEAD-GIMBAL ASSEMBLY, MICROACTUATOR, AND MANUFACTURING METHOD OF TH...

METHOD AND APPARATUS FOR MANUFACTURING A HEAD-GIMBAL ASSEMBLY

APPARATUS FOR INTERCONNECTING CONNECTION PADS OF A HEAD-GIMBAL ASSE...

Thermally insulating bonding pad structure for solder reflow connec...

Method and apparatus for manufacturing a head gimbal assembly

Method and apparatus for a microactuator bonding pad structure for...

Magnetic head assembly and magnetic disk drive

Head gimbal assembly and magnetic disk drive with solder ball conne...

Manufacturing method of head gimbal assembly with solder fillet and...

Thin film magnetic head and head gimbal assembly

Rotating disk storage device and integrated wire head suspension as...

Head/slider supporting structure and rotating disk storage device

Integrated lead suspension and method of construction

Integrated lead suspension and method of construction

Integrated lead suspension and method of construction

Integrated lead suspension and method of construction

Integrated lead suspension and method of construction

Base plate structure, transfer system, and method and apparatus for...

Base plate structure, transfer system, and method and apparatus for...

Base plate structure, transfer system, and method and apparatus for...

Integrated lead suspension and method of construction

Integrated lead suspension and method of construction

Solder-ball bonding device and method

Solder ball disposing apparatus, solder ball reflow apparatus, and...