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Tatsuo HIRASAWA
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Nirasaki, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Substrate processing method and apparatus
Patent number
12,027,353
Issue date
Jul 2, 2024
Tokyo Electron Limited
Shota Ishibashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sputtering apparatus
Patent number
12,014,911
Issue date
Jun 18, 2024
Tokyo Electron Limited
Shota Ishibashi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Sputtering apparatus and film forming method
Patent number
11,742,190
Issue date
Aug 29, 2023
Tokyo Electron Limited
Einstein Noel Abarra
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Film forming apparatus and method
Patent number
11,479,848
Issue date
Oct 25, 2022
Tokyo Electron Limited
Shota Ishibashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Film forming apparatus and film forming method
Patent number
11,158,492
Issue date
Oct 26, 2021
Tokyo Electron Limited
Hiroyuki Toshima
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Deposition device and deposition method
Patent number
10,309,005
Issue date
Jun 4, 2019
Tokyo Electron Limited
Yasuhiko Kojima
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method for forming copper film
Patent number
10,189,230
Issue date
Jan 29, 2019
Tokyo Electron Limited
Hiroyuki Toshima
C01 - INORGANIC CHEMISTRY
Information
Patent Grant
Copper wiring forming method with Ru liner and Cu alloy fill
Patent number
9,406,557
Issue date
Aug 2, 2016
Tokyo Electron Limited
Osamu Yokoyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cu wiring fabrication method and storage medium
Patent number
9,406,558
Issue date
Aug 2, 2016
Tokyo Electron Limited
Tadahiro Ishizaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plasma processing method and plasma processing apparatus
Patent number
9,253,862
Issue date
Feb 2, 2016
Tokyo Electron Limited
Tatsuo Hirasawa
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
SPUTTERING APPARATUS AND FILM FORMING METHOD
Publication number
20220044920
Publication date
Feb 10, 2022
TOKYO ELECTRON LIMITED
Einstein Noel ABARRA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PROCESSING METHOD AND APPARATUS
Publication number
20210305032
Publication date
Sep 30, 2021
TOKYO ELECTRON LIMITED
Shota ISHIBASHI
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SPUTTERING APPARATUS
Publication number
20210296103
Publication date
Sep 23, 2021
TOKYO ELECTRON LIMITED
Shota ISHIBASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FILM FORMING APPARATUS AND METHOD
Publication number
20210207261
Publication date
Jul 8, 2021
TOKYO ELECTRON LIMITED
Shota ISHIBASHI
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
FILM FORMING APPARATUS AND FILM FORMING METHOD
Publication number
20200043711
Publication date
Feb 6, 2020
TOKYO ELECTRON LIMITED
Hiroyuki Toshima
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
METHOD FOR FORMING COPPER FILM
Publication number
20180001597
Publication date
Jan 4, 2018
Hiroyuki TOSHIMA
B32 - LAYERED PRODUCTS
Information
Patent Application
DEPOSITION DEVICE AND DEPOSITION METHOD
Publication number
20160251746
Publication date
Sep 1, 2016
Tokyo Electron Limited
Yasuhiko KOJIMA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Cu Wiring Fabrication Method and Storage Medium
Publication number
20150332961
Publication date
Nov 19, 2015
TOKYO ELECTRON LIMITED
Tadahiro ISHIZAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RUTHENIUM FILM FORMING METHOD, RUTHENIUM FILM FORMING APPARATUS, AN...
Publication number
20150240344
Publication date
Aug 27, 2015
TOKYO ELECTRON LIMITED
Tadahiro ISHIZAKA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Copper Wiring Forming Method
Publication number
20150004784
Publication date
Jan 1, 2015
TOKYO ELECTRON LIMITED
Osamu YOKOYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
Publication number
20140090597
Publication date
Apr 3, 2014
TOKYO ELECTRON LIMITED
Tatsuo HIRASAWA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...