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Tatsuo HIRASAWA

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  • Nirasaki, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SPUTTERING APPARATUS AND FILM FORMING METHOD
    • Publication number 20220044920
    • Publication date Feb 10, 2022
    • TOKYO ELECTRON LIMITED
    • Einstein Noel ABARRA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATE PROCESSING METHOD AND APPARATUS
    • Publication number 20210305032
    • Publication date Sep 30, 2021
    • TOKYO ELECTRON LIMITED
    • Shota ISHIBASHI
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    SPUTTERING APPARATUS
    • Publication number 20210296103
    • Publication date Sep 23, 2021
    • TOKYO ELECTRON LIMITED
    • Shota ISHIBASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FILM FORMING APPARATUS AND METHOD
    • Publication number 20210207261
    • Publication date Jul 8, 2021
    • TOKYO ELECTRON LIMITED
    • Shota ISHIBASHI
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    FILM FORMING APPARATUS AND FILM FORMING METHOD
    • Publication number 20200043711
    • Publication date Feb 6, 2020
    • TOKYO ELECTRON LIMITED
    • Hiroyuki Toshima
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    METHOD FOR FORMING COPPER FILM
    • Publication number 20180001597
    • Publication date Jan 4, 2018
    • Hiroyuki TOSHIMA
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    DEPOSITION DEVICE AND DEPOSITION METHOD
    • Publication number 20160251746
    • Publication date Sep 1, 2016
    • Tokyo Electron Limited
    • Yasuhiko KOJIMA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Cu Wiring Fabrication Method and Storage Medium
    • Publication number 20150332961
    • Publication date Nov 19, 2015
    • TOKYO ELECTRON LIMITED
    • Tadahiro ISHIZAKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RUTHENIUM FILM FORMING METHOD, RUTHENIUM FILM FORMING APPARATUS, AN...
    • Publication number 20150240344
    • Publication date Aug 27, 2015
    • TOKYO ELECTRON LIMITED
    • Tadahiro ISHIZAKA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Copper Wiring Forming Method
    • Publication number 20150004784
    • Publication date Jan 1, 2015
    • TOKYO ELECTRON LIMITED
    • Osamu YOKOYAMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
    • Publication number 20140090597
    • Publication date Apr 3, 2014
    • TOKYO ELECTRON LIMITED
    • Tatsuo HIRASAWA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...