Tatsuo Inoue

Person

Musashino-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Secondary battery mounted chip manufacturing method
- Patent number 10,686,210
- Issue date Jun 16, 2020
- Kabushiki Kaisha Nihon Micronics
- Kazuyuki Tsunokuni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secondary battery-mounted circuit chip and manufacturing method the...
- Patent number 10,090,507
- Issue date Oct 2, 2018
- Kabushiki Kaisha Nihon Micronics
- Kazuyuki Tsunokuni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-type secondary battery
- Patent number 9,865,859
- Issue date Jan 9, 2018
- Kabushiki Kaisha Nihon Micronics
- Tomokazu Saitoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board with enclosed Ur-variant dual conductive layer
- Patent number 9,622,344
- Issue date Apr 11, 2017
- Kabushiki Kaisha Nihon Micronics
- Tatsuo Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric connecting apparatus
- Patent number 9,535,090
- Issue date Jan 3, 2017
- Kabushiki Kaisha Nihon Micronics
- Tatsuo Inoue
- G01 - MEASURING TESTING
Information Patent Grant
Electric connecting apparatus
- Patent number 9,400,309
- Issue date Jul 26, 2016
- Kabushiki Kaisha Nihon Micronics
- Hidehiro Kiyofuji
- G01 - MEASURING TESTING
Information Patent Grant
Probe card and method for manufacturing the same
- Patent number 9,341,651
- Issue date May 17, 2016
- Kabushiki Kaisha Nihon Micronics
- Osamu Arai
- G01 - MEASURING TESTING
Information Patent Grant
Computer program and method for generating wire routing pattern
- Patent number 8,365,130
- Issue date Jan 29, 2013
- Micronics Japan Co., Ltd.
- Katsushi Mikuni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing a multilayer wiring board
- Patent number 7,735,221
- Issue date Jun 15, 2010
- Kabushiki Kaisha Nihon Micronics
- Tatsuo Inoue
- G01 - MEASURING TESTING
Information Patent Grant
Electrical connecting apparatus
- Patent number 7,525,329
- Issue date Apr 28, 2009
- Kabushiki Kaisha Nihon Micronics
- Yuji Miyagi
- G01 - MEASURING TESTING
Information Patent Grant
Optical signal communication apparatus and optical signal communica...
- Patent number 6,246,499
- Issue date Jun 12, 2001
- Sony Corporation
- Yoshiyuki Kunito
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical transmission-reception apparatus
- Patent number 6,188,495
- Issue date Feb 13, 2001
- Sony Corporation
- Tatsuo Inoue
- G02 - OPTICS
Information Patent Grant
LSI package and manufacturing method thereof
- Patent number 6,153,447
- Issue date Nov 28, 2000
- NEC Corporation
- Tatsuo Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical fiber connector assembly
- Patent number 6,059,461
- Issue date May 9, 2000
- Molex Corporation
- Kazunori Aoki
- G02 - OPTICS
Information Patent Grant
Wiring board for mounting electronic devices with high-density term...
- Patent number 5,993,946
- Issue date Nov 30, 1999
- NEC Corporation
- Tatsuo Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip size package
- Patent number 5,909,010
- Issue date Jun 1, 1999
- NEC Corporation
- Tatsuo Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-circuit assembly and its manufacturing method
- Patent number 5,892,657
- Issue date Apr 6, 1999
- NEC Corporation
- Tatsuo Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LSI package and manufacturing method thereof
- Patent number 5,861,664
- Issue date Jan 19, 1999
- NEC Corporation
- Tatsuo Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Projection tv set apparatus
- Patent number 5,731,917
- Issue date Mar 24, 1998
- Sony Corporation
- Tatsuo Inoue
- G02 - OPTICS
Information Patent Grant
Projection TV set apparatus
- Patent number 5,617,259
- Issue date Apr 1, 1997
- Sony Corporation
- Tatsuo Inoue
- G02 - OPTICS
Information Patent Grant
Video camera
- Patent number 5,083,209
- Issue date Jan 21, 1992
- Sony Corporation
- Tatsuo Inoue
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multilayer wiring substrate
- Patent number 4,816,323
- Issue date Mar 28, 1989
- NEC Corporation
- Tatsuo Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large scale integrated circuit package
- Patent number 4,754,371
- Issue date Jun 28, 1988
- NEC Corporation
- Mitsuru Nitta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure for a chip
- Patent number 4,731,699
- Issue date Mar 15, 1988
- NEC Corporation
- Mitsuru Nitta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate
- Patent number 4,685,033
- Issue date Aug 4, 1987
- NEC Corporation
- Tatsuo Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portable video camera with image pick-up device
- Patent number 4,623,931
- Issue date Nov 18, 1986
- Sony Corporation
- Katsu Inaga
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Substrate having at least one fine-wired conductive layer
- Patent number 4,594,473
- Issue date Jun 10, 1986
- NEC Corporation
- Tatsuo Inoue
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SECONDARY BATTERY MOUNTED CHIP MANUFACTURING METHOD
- Publication number 20180226674
- Publication date Aug 9, 2018
- Kabushiki Kaisha Nihon Micronics
- Kazuyuki TSUNOKUNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECONDARY BATTERY-MOUNTED CIRCUIT CHIP AND MANUFACTURING METHOD THE...
- Publication number 20160181588
- Publication date Jun 23, 2016
- Kabushiki Kaisha Nihon Micronics
- Kazuyuki TSUNOKUNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED-TYPE SECONDARY BATTERY
- Publication number 20160043375
- Publication date Feb 11, 2016
- Kabushiki Kaisha Nihon Micronics
- Tomokazu SAITOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECONDARY BATTERY
- Publication number 20150188113
- Publication date Jul 2, 2015
- Kabushiki Kaisha Nihon Micronics
- Takuo Kudoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER WIRING BOARD AND PROCESS FOR MANUFCTURING THE SAME
- Publication number 20150107884
- Publication date Apr 23, 2015
- Kabushiki Kaisha Nihon Micronics
- Tatsuo Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC CONNECTING APPARATUS
- Publication number 20150008945
- Publication date Jan 8, 2015
- Kabushiki Kaisha Nihon Micronics
- Hidehiro KIYOFUJI
- G01 - MEASURING TESTING
Information Patent Application
ELECTRIC CONNECTING APPARATUS
- Publication number 20150008946
- Publication date Jan 8, 2015
- Kabushiki Kaisha Nihon Micronics
- Tatsuo INOUE
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140368229
- Publication date Dec 18, 2014
- Kabushiki Kaisha Nihon Micronics
- Osamu ARAI
- G01 - MEASURING TESTING
Information Patent Application
COMPUTER PROGRAM AND METHOD FOR GENERATING WIRE ROUTING PATTERN
- Publication number 20120167032
- Publication date Jun 28, 2012
- Micronics Japan Co., Ltd.
- Katsushi Mikuni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME AND P...
- Publication number 20080315901
- Publication date Dec 25, 2008
- Kabushiki Kaisha Nihon Micronics
- Tatsuo INOUE
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR TEST APPARATUS
- Publication number 20080297184
- Publication date Dec 4, 2008
- Kabushiki Kaisha Nihon Micronics
- Kiyotoshi MIURA
- G01 - MEASURING TESTING
Information Patent Application
ELECTRICAL CONNECTING APPARATUS
- Publication number 20080122467
- Publication date May 29, 2008
- Kabushiki Kaisha Nihon Micronics
- Yuji MIYAGI
- G01 - MEASURING TESTING

Tatsuo Inoue

Person

Patents Grantslast 30 patents

Secondary battery mounted chip manufacturing method

Secondary battery-mounted circuit chip and manufacturing method the...

Stacked-type secondary battery

Multilayer wiring board with enclosed Ur-variant dual conductive layer

Electric connecting apparatus

Electric connecting apparatus

Probe card and method for manufacturing the same

Computer program and method for generating wire routing pattern

Method for manufacturing a multilayer wiring board

Electrical connecting apparatus

Optical signal communication apparatus and optical signal communica...

Optical transmission-reception apparatus

LSI package and manufacturing method thereof

Optical fiber connector assembly

Wiring board for mounting electronic devices with high-density term...

Chip size package

Electronic-circuit assembly and its manufacturing method

LSI package and manufacturing method thereof

Projection tv set apparatus

Projection TV set apparatus

Video camera

Multilayer wiring substrate

Large scale integrated circuit package

Mounting structure for a chip

Multilayer wiring substrate

Portable video camera with image pick-up device

Substrate having at least one fine-wired conductive layer

Patents Applicationslast 30 patents

SECONDARY BATTERY MOUNTED CHIP MANUFACTURING METHOD

SECONDARY BATTERY-MOUNTED CIRCUIT CHIP AND MANUFACTURING METHOD THE...

STACKED-TYPE SECONDARY BATTERY

SECONDARY BATTERY

MULTI-LAYER WIRING BOARD AND PROCESS FOR MANUFCTURING THE SAME

ELECTRIC CONNECTING APPARATUS

ELECTRIC CONNECTING APPARATUS

PROBE CARD AND METHOD FOR MANUFACTURING THE SAME

COMPUTER PROGRAM AND METHOD FOR GENERATING WIRE ROUTING PATTERN

MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME AND P...

SEMICONDUCTOR TEST APPARATUS

ELECTRICAL CONNECTING APPARATUS