Tatsuo Kawata

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Ibaraki-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin-sealed semiconductor device, and die bonding material and sea...
- Patent number 6,774,501
- Issue date Aug 10, 2004
- Hitachi Chemical Co., Ltd.
- Kazuhiko Kurafuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Encapsulant composition and electronic device
- Patent number 6,284,818
- Issue date Sep 4, 2001
- Hitachi Chemical Company, Ltd.
- Tatsuo Kawata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Encapsulating material and LOC structure semiconductor device using...
- Patent number 6,211,277
- Issue date Apr 3, 2001
- Hitachi Chemical Company, Ltd.
- Tatsuo Kawata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin-encapsulated semiconductor device
- Patent number 5,567,990
- Issue date Oct 22, 1996
- Hitachi Chemical Company, Ltd.
- Tatsuo Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin encapsulated semiconductor device
- Patent number 4,965,657
- Issue date Oct 23, 1990
- Hitachi Ltd.
- Masatsugu Ogata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Resin-sealed semiconductor device, and die bonding material and sea...
- Publication number 20040000728
- Publication date Jan 1, 2004
- Kazuhiko Kurafuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...